Low Yield Analysis Engineer on Shift (Semiconductor)

Location: Hillsboro, Oregon, United States; on-site lab-based role with shift work required

Annual salary: $99,030–$139,810 USD

Company

hirify.global develops and manufactures semiconductor technologies, including integrated circuit and package assembly products.

What you will do

• Analyze back-end package assembly and wafer-level assembly sort and test failures to determine root causes of yield loss and in-line electrical failures.
• Design, test, modify, check out, and characterize wafer-level assembly technologies and semiconductor packages.
• Conduct hands-on laboratory work, define data acquisition and analysis plans, and recommend corrective actions.
• Develop failure-analysis techniques, best-known methods, and approaches to accelerate failure identification and mechanism understanding.
• Support package design, development, sustaining activities, manufacturing-process improvements, and customer requests.
• Coordinate execution across engineering technicians, shift engineers, module partners, yield and integration teams, suppliers, and customers.

Requirements

• Bachelor’s degree with at least two years of experience, or a master’s degree, in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
• Ability to work on-site in a laboratory environment and accommodate shift-based working hours.
• Strong analytical, problem-solving, communication, and presentation skills.
• Ability to work across organizational boundaries and adapt to changing priorities and ambiguous conditions.
• Experience with failure analysis, electrical fault isolation, semiconductor package characterization, or laboratory testing is relevant to the role.

Nice to have

• Experience with cross-sectioning, delayering, SEM, X-ray, microscopy, CSAM, ion milling, TEM, or FIB.
• Experience with hand probing, curve tracing, auto probing, TDR, EOTPR, EBAC, RIDR, or ELITE for electrical fault isolation.
• Experience with EDX, AFM, FTIR, Raman, XRD, or EBSD analysis techniques.
• Knowledge of package or die mapping software such as Mentor Graphics, SysNav/CadNav, or FIELD.
• Experience with SQL scripting and statistical analysis tools such as JMP.

Culture & Benefits

• Collaborative work with engineers, engineering technicians, internal teams, external suppliers, and customers.
• Competitive compensation with stock bonuses.
• Health, retirement, and vacation benefits.
• Fast-paced technical environment focused on yield improvement, failure analysis, and manufacturing innovation.