Materials Project Manager New College Grad- Bachelor's (Semiconductor)

Location: Chandler, AZ, United States. Onsite manufacturing and cleanroom work is required, including occasional lifting, moving materials, and extended periods of standing. Travel: 10% of the time. Relocation is not available.

Salary: $60,000–$77,000 per year, plus applicable bonus and stock award opportunities.

Company

hirify.global develops materials science and engineering solutions and semiconductor manufacturing equipment used in advanced chips and displays.

What you will do

• Forecast and communicate engineering, materials, and manufacturing requirements to suppliers.
• Coordinate materials planning through MRP and contribute to make-versus-buy analysis.
• Support new project materials strategies, commercialization plans, and material change control.
• Assess suppliers, monitor delivery, quality, and cost performance, and support negotiations.
• Identify critical and long-lead parts, inspection requirements, and supplier road maps with engineering.
• Track KPIs and total landed costs while resolving quality issues and improving operational efficiency.

Requirements

• Bachelor’s degree in Supply Chain, Operations, Engineering, or a related field, or equivalent experience.
• Experience in production control, materials planning, inventory control, or related operations.
• Hands-on materials management experience in a manufacturing environment.
• Strong understanding of ERP systems; SAP experience is highly preferred.
• Familiarity with MRP, inventory management, and shop floor control processes.
• Strong analytical, problem-solving, communication, and prioritization skills.

Culture & Benefits

• Supportive environment focused on learning, development, and career growth.
• Work within a global organization supporting semiconductor manufacturing and repair operations.
• Comprehensive employee benefits focused on health and wellbeing.
• Potential eligibility for bonus and stock award programs.

Hiring process

• Applications are reviewed on a rolling basis.
• Applications should be submitted by November 30, 2026; the position may close earlier based on application volume or candidate selection.