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4 дня назад

Physical Design Intern (Semiconductor)

Формат работы
onsite
Тип работы
fulltime
Грейд
trainee
Английский
b2
Страна
Singapore/US/China +1 еще
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Physical Design Intern (Semiconductor): Supporting block-level physical implementation and tapeout of ultra-low-power SoC designs in advanced process nodes with an accent on floorplanning, placement, clock tree synthesis, routing, and timing closure. Focus on analyzing setup and hold violations, performing power and signal integrity analysis, closing DRC/LVS issues, and automating physical design workflows with Tcl, Python, and Shell.

Location: Singapore

Company

hirify.global develops ultra-low-power semiconductor solutions for wearables, medical devices, IoT products, and AI-powered edge applications.

What you will do

  • Support block-level physical implementation for SoC designs.
  • Assist with floorplanning, placement, clock tree synthesis, routing, and timing closure.
  • Run static timing analysis and debug setup and hold violations.
  • Help analyze power, signal integrity, and IR drop under engineering guidance.
  • Contribute to DRC and LVS closure activities.
  • Develop Tcl, Python, and Shell scripts to automate recurring tasks, document results, and collaborate with RTL, verification, and physical design engineers.

Requirements

  • Currently pursuing a B.S. or M.S. in Electrical Engineering, Computer Engineering, or a related field.
  • Coursework in digital logic design and VLSI, physical design, or ASIC design.
  • Familiarity with Verilog or VHDL and digital design concepts, including timing, pipelining, and clocking.
  • Basic understanding of placement, routing, timing closure, clock trees, and power grid planning.
  • Comfortable working in a Linux/UNIX environment.

Nice to have

  • Coursework in computer architecture.

Culture & Benefits

  • Hands-on experience with industry-standard physical implementation tools.
  • Opportunity to work alongside experienced engineers on ultra-low-power chip tapeouts.
  • Mentorship, progress presentations, and exposure to complex semiconductor development work.

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