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обновлено 10 дней назад

Physical Design Engineer (AI)

Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Physical Design Engineer (AI): Implementing high-performance physical design blocks for CPU and AI/ML architectures from synthesis through tapeout with an accent on PPA optimization, timing closure, and advanced-node implementation. Focus on developing chiplet and low-power design methodologies, debugging complex hierarchical issues, and driving requirements from architecture through final signoff.

Location: Hybrid, based in Austin, Texas; Santa Clara, California; or Fort Collins, Colorado, United States

Compensation: $100,000–$500,000, including base and variable compensation targets.

Company

Tenstorrent develops AI computing technology, including high-performance RISC-V CPUs, AI platforms, compilers, networking, and semiconductor solutions.

What you will do

  • Implement high-performance physical design blocks for CPU and AI/ML architectures.
  • Own the complete implementation flow from synthesis through place-and-route, timing closure, and tapeout.
  • Optimize performance, power, and area through innovative implementation techniques and close RTL collaboration.
  • Debug complex issues across design hierarchies and drive physical design requirements from early architecture through final signoff.
  • Collaborate with architecture, RTL, IP, and other engineering teams on advanced AI accelerators, CPUs, SoCs, and chiplet architectures.

Requirements

  • BS, MS, or PhD in electrical engineering, computer engineering, computer science, or a related field.
  • Proven experience with synthesis, place-and-route, timing closure, and taped-out designs.
  • Expertise with Fusion Compiler, PrimeTime, and RedHawk.
  • Proficiency in Tcl, Perl, and Python scripting.
  • Deep understanding of advanced-node challenges and low-power techniques, including power gating, multi-Vt, and voltage scaling.
  • Eligibility to access U.S. export-controlled technology is required; employment may depend on citizenship, permanent residency, or prior export-license approval.

Culture & Benefits

  • Collaborative environment focused on curiosity and solving technically challenging problems.
  • Opportunity to work on AI accelerators, high-performance CPUs, and SoCs using advanced process nodes.
  • Direct impact on AI and high-performance computing products.
  • Competitive compensation and benefits package.
  • Offers are aligned with the candidate's assessed experience level, skills, education, background, and location.

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