Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Physical Design Engineer (AI): Implementing high-performance physical design blocks for CPU and AI/ML architectures from synthesis through tapeout with an accent on PPA optimization, timing closure, and advanced-node implementation. Focus on developing chiplet and low-power design methodologies, debugging complex hierarchical issues, and driving requirements from architecture through final signoff.
Location: Hybrid, based in Austin, Texas; Santa Clara, California; or Fort Collins, Colorado, United States
Compensation: $100,000–$500,000, including base and variable compensation targets.
Company
Tenstorrent develops AI computing technology, including high-performance RISC-V CPUs, AI platforms, compilers, networking, and semiconductor solutions.
What you will do
- Implement high-performance physical design blocks for CPU and AI/ML architectures.
- Own the complete implementation flow from synthesis through place-and-route, timing closure, and tapeout.
- Optimize performance, power, and area through innovative implementation techniques and close RTL collaboration.
- Debug complex issues across design hierarchies and drive physical design requirements from early architecture through final signoff.
- Collaborate with architecture, RTL, IP, and other engineering teams on advanced AI accelerators, CPUs, SoCs, and chiplet architectures.
Requirements
- BS, MS, or PhD in electrical engineering, computer engineering, computer science, or a related field.
- Proven experience with synthesis, place-and-route, timing closure, and taped-out designs.
- Expertise with Fusion Compiler, PrimeTime, and RedHawk.
- Proficiency in Tcl, Perl, and Python scripting.
- Deep understanding of advanced-node challenges and low-power techniques, including power gating, multi-Vt, and voltage scaling.
- Eligibility to access U.S. export-controlled technology is required; employment may depend on citizenship, permanent residency, or prior export-license approval.
Culture & Benefits
- Collaborative environment focused on curiosity and solving technically challenging problems.
- Opportunity to work on AI accelerators, high-performance CPUs, and SoCs using advanced process nodes.
- Direct impact on AI and high-performance computing products.
- Competitive compensation and benefits package.
- Offers are aligned with the candidate's assessed experience level, skills, education, background, and location.
Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →
Похожие вакансии
14 часов назад
Physical Design Engineer (AI)
250 000$
9 дней назад
Physical Design Implementation and Signoff Methodology Lead & Architect (AI/ML)
231 500 - 341 075$
13 дней назад
RTL Intern (AI Hardware)
9 дней назад
Physical Design Lead — Execution (FPGA)
231 500 - 341 075$
14 дней назад
Senior Verification Design Automation Engineer (AI/ASIC)
11 дней назад
Hardware Design Engineer, Systems (Storage Hardware)
180 000 - 270 000$