Senior Equipment Engineer (Wire Bond)

Location: Seremban, Malaysia; onsite semiconductor manufacturing role

Company

Global semiconductor manufacturing organization delivering semiconductor products through advanced assembly and packaging operations.

What you will do

• Lead troubleshooting and root cause analysis for Wire Bond equipment issues to reduce downtime and improve productivity.
• Drive equipment reliability, stability, OEE, yield, and cost improvement initiatives.
• Develop and implement preventive and predictive maintenance programs for Wire Bond machines.
• Support equipment installation, qualification, setup, buy-off, commissioning, and technology transfer activities.
• Analyze equipment performance data and implement corrective actions to improve machine efficiency and product quality.
• Provide technical guidance to junior engineers and technicians while supporting automation, digitalization, and Industry 4.0 initiatives.

Requirements

• Bachelor’s degree in Electrical, Electronics, Mechanical, Mechatronics, or a related engineering discipline.
• 3–5 years of experience in semiconductor manufacturing with hands-on Wire Bond equipment experience.
• Strong knowledge of Wire Bond equipment maintenance, troubleshooting, process support, machine parameters, and optimization.
• Experience with equipment reliability, preventive maintenance, OEE improvement, yield enhancement, and continuous improvement projects.
• Proficiency in root cause analysis methods including 8D, 5 Why, Fishbone Diagram, and FMEA.
• Strong analytical, problem-solving, communication, stakeholder management, ownership, and accountability skills.

Nice to have

• Experience with ASM, K&S, Hesse, or equivalent Wire Bond equipment platforms.
• Knowledge of automation, robotics, and smart manufacturing solutions.
• Lean Six Sigma Green Belt or equivalent certification.
• Leadership, mentoring, project management, or new equipment qualification experience.

Culture & Benefits

• Exposure to advanced semiconductor assembly and packaging technologies.
• Opportunities to lead equipment optimization and continuous improvement initiatives.
• Career growth and professional development programs.
• Collaborative and diverse international working environment.
• Competitive compensation and comprehensive employee benefits.