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5 дней назад

System Engineer IV - Wet Chemical Tool (Semiconductor)

161 000 - 221 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior/lead
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
System Engineer IV - Wet Chemical Tool (Semiconductor) (Electrochemical Deposition): Designing, integrating, and optimizing copper plating equipment for semiconductor manufacturing with an accent on system architecture, multidisciplinary subsystem integration, and wafer-level performance. Focus on solving complex root-cause problems, validating tool performance through testing and simulation, and driving systems from concept through production readiness.

Location: Santa Clara, California, United States. Full-time onsite role with approximately 25% travel. Relocation eligible.

Salary: $161,000–$221,000 per year, plus potential bonus and stock awards.

Company

hirify.global develops materials science and engineering equipment used in semiconductor chip and advanced display manufacturing.

What you will do

  • Lead end-to-end engineering projects for a next-generation copper Electrochemical Deposition platform.
  • Translate wafer-level performance requirements into system and engineering design requirements.
  • Integrate and manage interfaces across mechanical, electrical, controls, software, automation, fluid delivery, and chemistry subsystems.
  • Drive design, analysis, supplier engagement, build, bring-up, debugging, integration testing, qualification, and production readiness.
  • Optimize tradeoffs across performance, throughput, reliability, manufacturability, cost, and serviceability.
  • Investigate root causes, manage technical risks, validate solutions through structured testing and simulation, and communicate results to cross-functional teams, management, and customers.

Requirements

  • Master’s or PhD in Mechanical Engineering or a related discipline with 7+ years of applicable semiconductor equipment development experience; a bachelor’s degree with additional relevant experience may be considered.
  • Experience integrating multidisciplinary subsystems on complex capital equipment and driving tool bring-up, integration testing, and qualification through production readiness.
  • Experience with wet-process or electrochemical systems, such as copper plating or wafer cleaning, is strongly preferred.
  • 3D CAD experience with UG NX or equivalent.
  • Experience with statistical data analysis using JMP and Microsoft Excel or equivalent.
  • Strong root-cause investigation, technical leadership, written communication, and cross-functional collaboration skills.

Nice to have

  • Experience with ANSYS, CFD-Ace, COMSOL, or equivalent engineering analysis and simulation tools.

Culture & Benefits

  • Supportive work environment focused on learning, development, and career growth.
  • Comprehensive employee benefits supporting health and wellbeing.
  • Potential eligibility for bonus and stock award programs.
  • Regular collaboration with engineering, management, and customer teams.

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