Mechanical Design Engineer (Semiconductor Equipment)

Location: Totowa, New Jersey, USA; onsite

Salary: $85,600–$145,500 annually

Company

hirify.global develops inspection, measurement, and manufacturing systems for the semiconductor manufacturing ecosystem, including equipment for wafers, reticles, integrated circuits, packaging, printed circuit boards, and displays.

What you will do

• Create and modify 3D CAD models, subassemblies, system layouts, and flow diagrams for analyzers and dosers.
• Design and integrate mechanical, fluidic, and optical assemblies, including pumps, valves, tubing, fittings, spectrometers, light sources, electrodes, and motors.
• Customize systems for different chemistries, tank configurations, materials, sealing methods, plumbing routes, service access, and shipping constraints.
• Create and maintain BOMs, facility requirements, drawings, assembly instructions, installation layouts, labels, and other release documentation.
• Create and process Engineering Change Orders while maintaining traceability and revision history.
• Support prototype builds and troubleshooting through fit checks, tolerance-stack analysis, root-cause investigations, and corrective actions.

Requirements

• Bachelor's degree.
• No related work experience required.
• Experience or capability in mechanical design, 3D CAD modeling, system layouts, and engineering documentation.
• Ability to work with mechanical, fluidic, and optical assemblies, including materials compatibility and corrosion or chemical-resistance requirements.
• Must work onsite in Totowa, New Jersey, USA.

Culture & Benefits

• Collaborative work with physicists, engineers, data scientists, and problem-solvers on semiconductor manufacturing technology.
• Medical, dental, vision, life, and other voluntary benefits.
• 401(k) with company matching and an employee stock purchase program.
• Tuition reimbursement, student debt assistance, professional development, and career growth programs.
• Paid time off, paid company holidays, wellness benefits, and family care and bonding leave.

Hiring process

• Multiple interviews with hiring managers, conducted in person or by video conference.