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3 дня назад

Principal Failure Analysis Engineer (Semiconductor / Electronics)

120 000 - 160 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
c1
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Principal Failure Analysis Engineer (Semiconductor / Electronics): Conducting advanced semiconductor and electronics failure investigations, designing analytical methods, interpreting results, and guiding complex client projects with an accent on root-cause analysis, electrical testing, microscopy, and materials characterization. Focus on leading multidisciplinary laboratory teams, developing new techniques, and solving difficult manufacturing, design, and reliability failures.

Location: Irvine, California, USA; laboratory-based onsite role

Salary: USD 120,000–160,000 per year

Company

Eurofins EAG Laboratories provides engineering, materials testing, analytical chemistry, microscopy, surface analysis, and reliability services for technology and scientific industries.

What you will do

  • Conduct semiconductor and electronics failure analysis investigations for clients across medical devices, automotive, aerospace, military, consumer electronics, and manufacturing.
  • Define investigation scope, design analytical plans, execute laboratory methods, interpret results, and recommend corrective next steps.
  • Perform root-cause analysis, fault isolation, electrical measurements, microscopy, materials analysis, and device characterization.
  • Lead or collaborate with engineers on complex multidisciplinary projects, including project planning, legal projects, and client technical discussions.
  • Develop new analytical methods and techniques while working with changing samples, tools, and technologies.

Requirements

  • BSEE or MSEE degree.
  • Minimum 15+ years of direct, hands-on failure analysis laboratory experience in the semiconductor and electronics industry.
  • Hands-on expertise in root-cause failure analysis, OBIRCH, XIVA, EMMI, IR thermography, ATE datalog, curve tracing, bench testing, microprobing or picoprobing, 2D X-ray, and SEM/EDS.
  • Knowledge of semiconductor fabrication, electronics manufacturing, device physics, circuits, IC design, package assembly, yield enhancement, and reliability testing.
  • Must qualify as a U.S. Person under ITAR: U.S. citizen, U.S. permanent resident, political asylee, or refugee.
  • Excellent written and spoken English communication skills are required. Ability to work safely, accurately, independently, and to deadlines in a team-oriented laboratory environment.

Nice to have

  • Experience as a technical lead, manager, or mentor.
  • Experience with LVP/LTP, SDL/LADA, DBFIB, PFIB, 3D X-ray, C-SAM, deprocessing, chemical or plasma etching, cross-sectioning, nanoprobing, FinFET, advanced nodes, DPA, GDS layout, or LabView.
  • Knowledge of Mil-Std, AEC, JEDEC, IPC, NPI, and qualification testing.

Culture & Benefits

  • Collaborative, team-centered environment focused on precision, curiosity, learning, and technical impact.
  • Medical, dental, and vision coverage.
  • 401(k) company matching and paid time off.
  • Wellness program and education assistance.
  • Career development, mentoring, and leadership growth opportunities.
  • Personal protective equipment and reasonable workplace accommodations are provided as applicable.

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