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3 дня назад

Sr. Principal Engineer: Silicon Photonics-Hybrid Integration

149 900 - 214 150$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Sr. Principal Engineer: Silicon Photonics-Hybrid Integration (Silicon Photonics/III-V Integration): Developing high-volume process flows that integrate III-V materials with silicon photonics for photonic integrated circuits serving cloud, networking, data center, and AI applications with an accent on process integration, photonic device fabrication, and performance optimization. Focus on designing 2D, 2.5D, and 3D integration approaches, analyzing test results, improving manufacturing yield, and coordinating fabrication, design, and test engineering teams.

Location: USA - CA - San Jose (Ridder)

Salary: $149,900–$214,150 per year

Company

hirify.global develops optical and photonic solutions for high-speed networks, cloud computing, data centers, telecommunications, AI, and advanced manufacturing.

What you will do

  • Develop III-V to silicon photonics hybrid integration process flows for novel photonic components.
  • Design process steps and integrate chip functionality within photonic integrated circuit development programs.
  • Collaborate with wafer fabrication and back-end process integration partners to meet customer specifications, manufacturing capabilities, and tolerance requirements.
  • Develop test and verification plans with test engineering teams and analyze engineering measurements.
  • Optimize component performance, specification margins, yield, and cost for high-volume manufacturing.
  • Coordinate communication across fabrication, design, test, and photonics development teams.

Requirements

  • PhD in Electrical Engineering or Physics, or an equivalent combination of education and work experience.
  • Solid background in optical physics and photonics, including advanced IC and photonic IC integration methods.
  • Experience with 2D, 2.5D, and 3D stacking approaches and photonic component development.
  • Strong background in photonic device fabrication, test-result analysis, and photonic chip characterization.
  • Experience with wafer fabrication or post-wafer fabrication process development.
  • Excellent oral and written English communication and presentation skills, with strong analytical and problem-solving abilities.

Nice to have

  • Proficiency with photonics simulation techniques such as FDTD and EME, using platforms such as Lumerical or Synopsys.
  • Experience with photonic integrated circuit design flows, physical layout, and verification software.

Culture & Benefits

  • Flexible time off.
  • Health and wellness benefits, including physical and mental health support.
  • Tuition reimbursement and career growth support.
  • On-site gym, games room, prayer room, and subsidized meals.
  • Free coffee and tea, employee stock options, and incentive plans.
  • Collaborative, innovative, and inclusive workplace.

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