9 дней назад
Manager, Digital Design (PCIe/CXL)
216 000 - 240 000$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Manager, Digital Design (PCIe/CXL): Leading front-end digital design for high-performance PCIe, CXL, UAL, and Ethernet devices that enable rack-scale AI connectivity with an accent on RTL quality, tape-out readiness, and end-to-end chip delivery. Focus on guiding designs from architecture through shipment, resolving performance, power, area, clocking, and integration challenges, and leading a team of 6–8 digital design engineers.
Location: San Jose, California, United States
Salary: $216,000–$240,000 per year, depending on experience, level, and business need. The role may also be eligible for discretionary bonuses, incentives, and benefits.
Company
develops purpose-built connectivity solutions and software for rack-scale AI infrastructure, integrating PCIe, CXL, Ethernet, NVLink, and UALink technologies.
What you will do
- Lead digital chip development from product requirements and architecture through RTL, verification, tape-out, production, and shipment.
- Drive delivery of at least two complex devices with clear milestones, technical decisions, risk tracking, and schedule accountability.
- Translate PCIe, CXL, UAL, and Ethernet requirements into robust, scalable digital implementations.
- Set RTL quality standards, design checklists, review gates, coding practices, and signoff criteria for the digital design lifecycle.
- Resolve performance, power, area, clocking, and integration issues with verification, physical design, DFT, validation, firmware, and operations teams.
- Lead, mentor, and develop a team of 6–8 digital design engineers while communicating technical status, tradeoffs, dependencies, and mitigation plans.
Requirements
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical field.
- Experience with PCIe, CXL, UAL, and Ethernet digital design, including protocol implementation, high-speed connectivity requirements, and physical-layer considerations.
- 3–5 years of engineering management or technical leadership experience in digital IC or ASIC design.
- Ownership of chip design and development from requirements through tape-out and shipment for at least two reasonably complex devices.
- Strong hands-on experience developing front-end RTL and applying design practices that support predictable physical design progress and tape-out quality.
- Ability to lead 6–8 engineers and influence execution across architecture, verification, physical design, DFT, firmware, validation, and operations.
Nice to have
- Expertise in RTL quality methodologies, design reviews, lint, clock-domain and reset-domain considerations, synthesis, timing, and signoff readiness.
- Experience improving design checklists, development flows, quality gates, and cross-functional tape-out processes.
- Experience building design blocks with large physical floorplan sizes.
- Experience balancing performance, power, area, schedule, and risk across large SoC or ASIC programs.
- Master’s or PhD in Electrical Engineering, Computer Engineering, or a related field.
Culture & Benefits
- Work on connectivity products supporting the next generation of AI systems.
- Collaborate with hyperscalers, ecosystem partners, and cross-functional engineering teams.
- Potential eligibility for discretionary bonuses, incentives, and benefits.
- Commitment to diverse ideas, backgrounds, and experiences in the workplace.
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