Packaging Module Development Engineer (Semiconductor Packaging)

Location: On-site in Phoenix, Arizona, United States.

Annual salary: $133,800–$188,890 USD.

Company

hirify.global designs and manufactures semiconductor technologies, including advanced packaging and next-generation chip architectures.

What you will do

• Develop, optimize, and qualify packaging assembly processes and equipment against quality, reliability, yield, and cost targets.
• Lead experimental design and process characterization using Design of Experiments and Statistical Process Control.
• Develop techniques, materials, and tools addressing packaging quality and reliability challenges.
• Collaborate with cross-functional teams to identify and mitigate technical risks across product development milestones.
• Establish material and equipment specifications and work with suppliers to meet performance and quality standards.
• Provide technical support for packaging challenges in development and high-volume manufacturing, document findings, and drive manufacturing standardization across hirify.global sites.

Requirements

• Bachelor’s or Master’s degree in engineering, Physics, Chemistry, or a related STEM field with 6+ months of relevant industry experience, or a PhD in Engineering, Physics, Chemistry, or a related STEM field.
• Relevant experience with Statistical Process Control and Design of Experiments.
• Hands-on experience with process development, equipment qualification, and characterization in a packaging or manufacturing environment.
• Data analysis and risk assessment capabilities to support technical decision-making.
• Collaborative, results-oriented, adaptable, curious, and accountable approach with clear technical communication and a growth mindset.

Nice to have

• 6+ months of experience leading technical teams and collaborating across matrixed organizations.
• Knowledge of advanced semiconductor fabrication processes, assembly methodologies, and packaging flows.
• Knowledge of machine vision systems, automated inspection, and camera-based measurement techniques.
• Programming experience with Python, MATLAB, or SQL for complex dataset analysis.

Culture & Benefits

• On-site work at hirify.global’s advanced Arizona semiconductor research, development, and manufacturing facilities.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.
• Work with cross-functional engineering teams on advanced semiconductor packaging technologies.