Module Product Engineer (Power Modules)

Location: Hybrid in Tempe, Arizona, USA; remote work is not available. Applicants must be authorized to work full-time in the United States.

Company

hirify.global is a global semiconductor company developing embedded solutions and AI-focused power delivery products, including digital power VRMs, multiphase controllers, Smart Power Stages, Power Towers, and power MOSFETs.

What you will do

• Own product engineering execution for advanced power modules from new product introduction through high-volume production and sustaining.
• Drive manufacturability and robust assembly processes across outsourced semiconductor assembly and test providers and internal manufacturing sites.
• Lead product bring-up, characterization, silicon readiness, qualification, manufacturing release, and product change management.
• Coordinate Design, Test, Quality, Applications, and Manufacturing teams to deliver scalable, high-yield module production.
• Resolve assembly excursions involving die attach, clip attach, solder integrity, and module-level defects.
• Lead yield analysis, parametric trend monitoring, root-cause investigations, cost reduction, and cycle-time improvement.

Requirements

• Current full-time authorization to work in the United States is required.
• Visa sponsorship is not available now or in the future.
• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field.
• 8+ years of experience in semiconductor product, manufacturing, or test engineering, including ownership from NPI through high-volume production.
• Strong technical knowledge of semiconductor power products, advanced power module manufacturing, statistical data analysis, qualification, and manufacturing transfer.
• Strong communication skills and the ability to lead complex technical decisions, escalations, and cross-functional execution.

Nice to have

• Master’s degree in a relevant engineering discipline.
• Mechanical Engineering background focused on module packaging, thermomechanical behavior, or assembly optimization.

Culture & Benefits

• Collaborative culture grounded in transparency, agility, global collaboration, innovation, and entrepreneurship.
• Work on semiconductor technologies serving automotive, industrial, infrastructure, and IoT applications.
• Competitive benefits package alongside salary.
• Work with a global organization of more than 21,000 engineers and problem solvers across over 30 countries.