Principal ASIC Package Design Engineer (Aerospace)

Location: United States - Remote

Company

Develops high-power satellite platforms for commercial and US government missions from LEO to deep space.

What you will do

• Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-ups, ball maps, power delivery, signal breakout, and mechanical constraints.
• Lead package-level trade studies covering cost, performance, power integrity, signal integrity, thermal behavior, manufacturability, and reliability.
• Define packaging roadmaps, design standards, methodologies, materials, substrate technologies, and assembly processes.
• Drive detailed package design for high-pin-count ASICs with high-speed SerDes, dense power grids, RF content, PDN design, and decoupling strategies.
• Lead package thermal architecture, including lids, TIMs, heat spreaders, and interfaces with system cooling.
• Manage OSAT, substrate supplier, and packaging vendor relationships through qualification, capability assessment, negotiation, and production ramp.

Requirements

• Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
• 10+ years of ASIC package design experience with deep FC-BGA expertise.
• Production experience delivering high-pin-count, high-performance ASIC packages.
• Strong knowledge of substrate technologies and materials, package-level SI/PI, and thermal management for power-dense ASICs.
• Fluency with SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.
• Direct experience with OSATs and substrate vendors, plus knowledge of packaging qualification and test methodologies. Employment requires either U.S. person status under ITAR or eligibility for a federally issued export control license.

Nice to have

• Experience with MCM or heterogeneous integration, including chiplets, interposers, or advanced laminates.
• Background in high-speed digital or mixed-signal SoCs.
• Experience with aerospace, space, or high-reliability electronics.
• Experience defining packaging strategy from early architecture through first silicon and volume ramp.
• Experience building or scaling package design methodologies within an organization.

Culture & Benefits

• Work on high-power satellite platforms intended for multiple orbits and deep-space missions.
• Fast-paced environment at a high-growth, Series D-funded company.
• Reasonable accommodations are available during the application and interview process.
• Employment decisions are based on merit, competence, and qualifications.