Module Engineering - PhD Intern (Semiconductor Manufacturing)

Location: On-site in Hillsboro, Oregon, United States.

Salary: $120,898–$120,902 annual target compensation.

Company

hirify.global Foundry Services develops diffusion and implantation processes and manufacturing methodologies for semiconductor production.

What you will do

• Support the development and implementation of semiconductor manufacturing processes for a specific module.
• Sustain and improve manufacturing equipment performance, operational efficiency, and reliability.
• Troubleshoot equipment and support qualification activities against production standards.
• Collaborate with engineering teams to optimize process control methodologies and achieve production targets.
• Apply statistical analysis and design of experiments to improve process reliability and throughput.
• Perform materials and physical device characterization, including SEM and TEM techniques, and contribute to continuous improvement of process control systems.

Requirements

• Ph.D. degree in progress in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related STEM field.
• Hands-on experience or knowledge of semiconductor processing fundamentals, including lithography, etching, polishing, and deposition.
• Familiarity with statistical data analysis and design of experiments methodologies.
• Experience in materials and physical device characterization, such as SEM or TEM.

Nice to have

• Advanced transistor device structures and architectures, including fabrication with Atomic Layer Deposition, Chemical Vapor Deposition, Rapid Thermal Annealing, ion implantation, and surface treatments or modification.
• In-depth knowledge of semiconductor device physics and process integration.
• Scripting or programming skills in Python, JSL, Perl, TCL, SQL, C, or C++.
• Expertise in semiconductor processing, including lithography, wet etch, dry etch, and chemical or mechanical polishing.
• Expertise in design of experiments, data analysis, materials and physical device characterization, semiconductor device testing, process control systems, sources of variability, and statistics.

Culture & Benefits

• Full-time student internship with on-site work.
• Hands-on experience in semiconductor manufacturing, process development, equipment improvement, and characterization.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.

Hiring process

• The recruiter can provide the specific compensation range for the preferred location and job role.