Назад
Company hidden
4 дня назад

Module Engineering PhD Intern Summer 2027 (Semiconductor Manufacturing)

120 898 - 120 902$
Формат работы
onsite
Тип работы
fulltime
Грейд
trainee
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
/
TL;DR
Module Engineering PhD Intern Summer 2027 (Semiconductor Manufacturing): Developing and optimizing semiconductor manufacturing processes and equipment for diffusion and implantation modules with an accent on process control, statistical analysis, and materials and device characterization. Focus on troubleshooting and qualifying manufacturing equipment, designing experiments, and improving process reliability and production throughput.

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $120,898–$120,902 USD

Company

hirify.global Foundry Services develops semiconductor manufacturing technologies, including diffusion and implantation processes.

What you will do

  • Support the development and implementation of semiconductor manufacturing processes for a specific module.
  • Sustain, troubleshoot, qualify, and improve manufacturing equipment.
  • Collaborate with engineering teams to optimize process control and achieve production targets.
  • Apply statistical analysis and design of experiments to improve process reliability and throughput.
  • Perform materials and physical device characterization using techniques such as SEM and TEM.
  • Contribute to continuous improvement of process control systems and methodologies.

Requirements

  • PhD in progress in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related STEM field.
  • Hands-on experience or knowledge of semiconductor processing fundamentals, including lithography, etching, polishing, and deposition.
  • Familiarity with statistical data analysis and design of experiments.
  • Experience with materials and physical device characterization, such as SEM or TEM.
  • Ability to work on-site in Hillsboro, Oregon, United States.

Nice to have

  • Knowledge of transistor structures, semiconductor device physics, and process integration.
  • Experience with Atomic Layer Deposition, Chemical Vapor Deposition, Rapid Thermal Annealing, ion implantation, or surface treatment.
  • Scripting or programming skills in Python, JSL, Perl, TCL, SQL, C, or C++.
  • Knowledge of process control systems, variability sources, semiconductor device testing, and statistics.

Culture & Benefits

  • Hands-on internship in a semiconductor manufacturing environment.
  • Collaboration with engineering teams focused on innovation and production excellence.
  • Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.

Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →