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3 дня назад

Engineer I-Process (Semiconductor Manufacturing)

70 304 - 143 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
junior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Engineer I-Process (Semiconductor Manufacturing): Supporting wafer fabrication equipment and processes across photolithography, etch, deposition, diffusion, and related technologies with an accent on process recipe optimization, SPC, documentation, and new-process qualification. Focus on designing experiments, analyzing manufacturing performance, maintaining process records, and solving complex production challenges with cross-functional engineering teams.

Location: Lawrence, Massachusetts, United States; onsite semiconductor manufacturing facility

Annual base salary: $70,304–$143,000, plus restricted stock units and quarterly bonuses.

Company

Global semiconductor technology manufacturer developing products and solutions that power electronic systems worldwide.

What you will do

  • Support wafer fabrication equipment and processes in areas such as photolithography, etch, deposition, and diffusion.
  • Monitor, maintain, and optimize process recipes to ensure consistent manufacturing performance and product quality.
  • Create and update documentation for product manufacturing and equipment operation.
  • Implement and monitor tool and process statistical process control.
  • Design, run, and document experiments under the direction of senior engineers.
  • Qualify new processes and processes running on new tools while supporting continuous improvement projects.

Requirements

  • Bachelor’s degree in Chemical Engineering, Electrical Engineering, Materials Science, or a related engineering discipline.
  • Experience, coursework, or knowledge of best-practice engineering principles.
  • Strong Microsoft Office skills, including high proficiency in Excel.
  • Ability to develop solutions to manufacturing problems, organize technical information, and present process-improvement recommendations.
  • Effective verbal and written communication skills in English.
  • Must provide proof of US citizenship, permanent US residency, or protected-individual status under US export-control requirements.

Nice to have

  • Coursework or internship experience with semiconductor products or in a semiconductor fabrication environment.
  • Familiarity with Design of Experiments, Statistical Process Control, and Gage R&R.
  • Six Sigma or Lean manufacturing certification.

Culture & Benefits

  • Collaborative work with process and product engineers in a small-scale fabrication facility.
  • Health benefits beginning on the first day of employment.
  • Retirement savings plans and an employee stock purchase program with a two-year lookback feature.
  • Travel requirement of 0%–25%.
  • Physical work distribution: 60% sitting, 20% standing, and 20% walking.

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