Packaging Technology Development Graduate Intern (Semiconductor Manufacturing)

Location: On-site in Phoenix, Arizona, United States

Annual salary: $120,898–$120,902 USD

Company

hirify.global Foundry advances semiconductor technology and manufacturing processes for high-quality production.

What you will do

• Develop and optimize manufacturing processes for specialized semiconductor modules.
• Support equipment troubleshooting, maintenance, and qualification activities.
• Collaborate with engineering teams to sustain and improve processes and equipment.
• Apply process characterization and Design of Experiments (DOE) methods.
• Conduct structured data analysis and experiments to identify process improvements.
• Work hands-on in engineering projects within a cleanroom environment.

Requirements

• Be pursuing a PhD in Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, Polymer Engineering, or a related field.
• Have at least 3 months of relevant experience in semiconductor manufacturing equipment or process development.
• Have experience with data analysis tools such as MATLAB, Python, or JMP.
• Be able to work on-site in Phoenix, Arizona, United States.

Nice to have

• GPA of 3.0 or higher.
• Hands-on experience with process optimization, engineering troubleshooting tools, or cleanroom environments.
• Familiarity with DOE, structured problem-solving, and statistical data analysis.
• Experience in failure analysis, yield analysis, and process improvement strategies.

Culture & Benefits

• Full-time student internship within hirify.global Foundry.
• Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
• Hands-on work with semiconductor manufacturing equipment and engineering teams.
• Responsible Business Alliance compliance and ethical hiring practices.