Technologist, Packaging Engineering (AI)

Location: Milpitas, United States — onsite at the Milpitas Office

Salary: $147,710–$244,674 per year

Company

hirify.global develops Flash memory and advanced memory technology products supported by global manufacturing capabilities and high-volume production facilities.

What you will do

• Set technical direction for package engineering on cross-functional leadership teams and lead packages through characterization, qualification, release, and production.
• Own the package lifecycle across design, development, qualification, manufacturing, and high-volume introduction.
• Coordinate with global factories, contract manufacturers, and Packaging R&D teams to develop scalable, cost-effective packaging and assembly processes.
• Drive assembly yield improvement, package cost-reduction programs, technology roadmaps, budgets, and packaging infrastructure development.
• Establish readiness for FMEA, SOD, control plans, process recipes, SPC, and other assembly controls before high-volume production.
• Evaluate package designs through characterization builds and DFX analyses, including DFM, DFA, and DFRW, while influencing product architecture and manufacturing strategy.

Requirements

• Master’s degree or PhD in Materials Science, Manufacturing, Mechanical Engineering, Computer Science, Physics, or another engineering discipline.
• At least 10 years of relevant experience with a Master’s degree, or 8+ years with a PhD.
• Strong knowledge of SMT, PCBA, solder-joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout.
• Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives.
• Strong problem-solving skills, including experimental design and statistical analysis.
• Excellent written and verbal communication skills for collaboration with global cross-functional teams.

Nice to have

• Experience with die attach, wire bonding, wafer thinning, and molding processes.
• Experience with machine learning and data analytics using AI technologies.
• Experience mentoring or managing junior engineers.
• Familiarity with industry benchmarking trends and packaging technology roadmap development.

Culture & Benefits

• Paid vacation and sick leave.
• Medical, dental, vision, life, accident, and disability insurance.
• Flexible spending and health savings accounts, employee assistance, and voluntary benefit programs.
• Tuition reimbursement, transit benefits, employee stock purchase plan, and 401(k) plan.
• Eligibility for short-term incentives and, depending on role and performance, long-term incentive or restricted stock unit programs.
• Inclusive workplace with equal employment opportunities and disability accommodations.