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Semiconductor Device Modeling Engineer

128 880 - 245 160$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
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TL;DR
Semiconductor Device Modeling Engineer (Semiconductor Device Physics/Compact Modeling): Supporting compact modeling for Intel's advanced semiconductor technologies with an accent on transistor modeling, device physics, and data-driven analysis. Focus on developing BSIM-CMG and other compact models, modeling layout-dependent and self-heating effects, and building extraction, targeting, and statistical variation methodologies.

Location: On-site in Hillsboro, Oregon, or Santa Clara, California, United States

Annual salary: $128,880–$245,160 USD

Company

Intel develops semiconductor technologies, advanced process platforms, and design and manufacturing services for data-centric applications.

What you will do

  • Support compact device modeling activities for Intel's new semiconductor technologies.
  • Develop and apply compact models for advanced transistor technologies, including FinFET and GAAFET.
  • Develop methodologies for device targeting, benchmark circuits, process corners, and statistical variation models.
  • Model layout-dependent effects and self-heating effects and assess their impact on device and circuit performance.
  • Collaborate across multiple technical teams and geographies to enable semiconductor design and manufacturing.

Requirements

  • Bachelor's degree in Electrical Engineering or a related discipline with 5+ years of semiconductor industry experience, or a master's degree with 3+ years of experience, or a Ph.D. in Electrical Engineering or a related discipline.
  • Graduate coursework, research experience, or 5+ years of work experience in semiconductor device physics.
  • At least 1 year of experience using Python for data analysis, automation, and documentation.
  • Understanding of semiconductor process flow, layout, and basic circuit design and simulation.
  • Ability to work on-site in Hillsboro, Oregon, or Santa Clara, California.

Nice to have

  • Ph.D. in Electrical Engineering or a related discipline with 3+ years of semiconductor industry experience.
  • Proficiency with extraction tools such as ICCAP or MBP and commercial simulators such as HSPICE or Spectre.
  • Experience with BSIM-CMG, Open Model Interface, layout-dependent effects, self-heating, FinFET, or GAAFET modeling.
  • Experience applying machine learning algorithms to data analysis and compact model development.

Culture & Benefits

  • Competitive compensation with stock bonuses.
  • Health, retirement, and vacation benefits.
  • Work in Intel's Compact Device Modeling Group within the Design Technology Platform organization.
  • Opportunity to support technologies used by Intel Foundry customers.

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