обновлено 11 дней назад
Semiconductor Device Modeling Engineer
128 880 - 245 160$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Semiconductor Device Modeling Engineer (Semiconductor Device Physics/Compact Modeling): Supporting compact modeling for Intel's advanced semiconductor technologies with an accent on transistor modeling, device physics, and data-driven analysis. Focus on developing BSIM-CMG and other compact models, modeling layout-dependent and self-heating effects, and building extraction, targeting, and statistical variation methodologies.
Location: On-site in Hillsboro, Oregon, or Santa Clara, California, United States
Annual salary: $128,880–$245,160 USD
Company
Intel develops semiconductor technologies, advanced process platforms, and design and manufacturing services for data-centric applications.
What you will do
- Support compact device modeling activities for Intel's new semiconductor technologies.
- Develop and apply compact models for advanced transistor technologies, including FinFET and GAAFET.
- Develop methodologies for device targeting, benchmark circuits, process corners, and statistical variation models.
- Model layout-dependent effects and self-heating effects and assess their impact on device and circuit performance.
- Collaborate across multiple technical teams and geographies to enable semiconductor design and manufacturing.
Requirements
- Bachelor's degree in Electrical Engineering or a related discipline with 5+ years of semiconductor industry experience, or a master's degree with 3+ years of experience, or a Ph.D. in Electrical Engineering or a related discipline.
- Graduate coursework, research experience, or 5+ years of work experience in semiconductor device physics.
- At least 1 year of experience using Python for data analysis, automation, and documentation.
- Understanding of semiconductor process flow, layout, and basic circuit design and simulation.
- Ability to work on-site in Hillsboro, Oregon, or Santa Clara, California.
Nice to have
- Ph.D. in Electrical Engineering or a related discipline with 3+ years of semiconductor industry experience.
- Proficiency with extraction tools such as ICCAP or MBP and commercial simulators such as HSPICE or Spectre.
- Experience with BSIM-CMG, Open Model Interface, layout-dependent effects, self-heating, FinFET, or GAAFET modeling.
- Experience applying machine learning algorithms to data analysis and compact model development.
Culture & Benefits
- Competitive compensation with stock bonuses.
- Health, retirement, and vacation benefits.
- Work in Intel's Compact Device Modeling Group within the Design Technology Platform organization.
- Opportunity to support technologies used by Intel Foundry customers.
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