Optomechanical Engineer (Semiconductor Packaging)

Location: Austin, United States; on-site

Salary: $130,000–$180,000 annually, plus equity

Company

Develops the hardware, software, fabrication facilities, tools, and components required to manufacture semiconductor devices and packaging solutions.

What you will do

• Own optomechanical system development from concept through operation, including mechanical design, optical layout, precision assembly, wiring, controls integration, alignment, and debugging.
• Develop laser micromachining equipment and processes with vision-based alignment and inspection systems.
• Create and validate semiconductor packaging processes from early experiments through repeatable, multi-step process flows.
• Plan and execute experiments involving deposition, etch, lithography, bonding, die attach, and related packaging processes.
• Collaborate with process, mechanical, electrical, controls, and software engineers to move from concepts to working hardware.
• Maintain design documentation, experiment records, operating procedures, and equipment maintenance requirements.

Requirements

• Hands-on experience designing, building, integrating, or substantially modifying process equipment or scientific instruments.
• Experience with optomechanical system design and integration, including mechanical design, optics, precision assembly, wiring, controls, alignment, and system debugging.
• Experience developing laser micromachining processes and working with vision-based alignment systems.
• Proficiency in metrology and failure analysis, including developing custom tools or methods to quantify process performance and improvement.
• Ability to work independently in a fast-moving R&D environment and own projects from concept through functional hardware and validated process results.
• Ability to work on-site in Austin and serve in compliance with U.S. export controls.

Nice to have

• Experience with metal plating.
• Exposure to advanced semiconductor packaging technologies, including interposers, through-vias, redistribution layers, hybrid bonding, thermocompression bonding, flip chip, and underfill.
• Experience with ultrafast laser micromachining.

Culture & Benefits

• Hands-on work in a fast-moving research and development environment.
• Medical, dental, and vision insurance.
• Paid time off including holidays and sick time, plus paid parental leave.
• Visa sponsorship available.
• Life and disability insurance, a 401(k) retirement plan, and equity compensation.
• Weekly learning and development opportunities, commuter benefits, office meals, and stocked kitchen.