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10 дней назад

ATD MIHL Equipment Development Engineer (Semiconductor Packaging)

115 110 - 162 500$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
ATD MIHL Equipment Development Engineer (Semiconductor Packaging): Developing and optimizing packaging processes and equipment for next-generation semiconductor assembly technologies with an accent on manufacturing efficiency, reliability, quality, and yield. Focus on applying DOE and SPC, designing equipment for simulated field conditions, defining material specifications, and solving packaging reliability and manufacturability challenges.

Location: On-site in Phoenix, Arizona, United States

Annual salary: $115,110–$162,500 USD

Company

hirify.global develops semiconductor technologies and packaging solutions for its product portfolio.

What you will do

  • Develop and refine packaging processes and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability targets.
  • Apply Design of Experiments and statistical methods to optimize processes and specifications, documenting results in technical reports.
  • Design and maintain equipment for evaluating packaging technologies under simulated field conditions, including heat, humidity, temperature cycling, and dynamic forces.
  • Define material specifications and collaborate with supplier quality and procurement teams.
  • Develop techniques, tools, and quality screens to identify packaging reliability risks and establish reliability benchmarks.
  • Lead problem-solving and continuous-improvement initiatives, advise internal teams and partners, and standardize qualification and manufacturing quality practices.

Requirements

  • Bachelor’s degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience; alternatively, a master’s degree with 2+ years or a PhD with 6+ months of relevant experience.
  • Proficiency in Statistical Process Control and Design of Experiments principles.
  • Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing.
  • Competency with mechanical design software such as SolidWorks or AutoCAD.
  • Applicants must be able to work on-site in Phoenix, Arizona, United States.
  • This position is not eligible for hirify.global immigration sponsorship.

Nice to have

  • Experience leading technical innovation and managing complex, time-sensitive projects.
  • Understanding of semiconductor fabrication processes and packaging technologies.
  • Experience with supply chain management in manufacturing or materials qualification.
  • Experience with high-precision manufacturing methods, including stamping and CNC machining.

Culture & Benefits

  • Competitive compensation with stock bonuses.
  • Health, retirement, and vacation benefits.
  • Collaboration with cross-functional teams on advanced packaging and manufacturing technologies.
  • Shift 1 schedule in the United States.

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