10 дней назад
ATD MIHL Equipment Development Engineer (Semiconductor Packaging)
115 110 - 162 500$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
ATD MIHL Equipment Development Engineer (Semiconductor Packaging): Developing and optimizing packaging processes and equipment for next-generation semiconductor assembly technologies with an accent on manufacturing efficiency, reliability, quality, and yield. Focus on applying DOE and SPC, designing equipment for simulated field conditions, defining material specifications, and solving packaging reliability and manufacturability challenges.
Location: On-site in Phoenix, Arizona, United States
Annual salary: $115,110–$162,500 USD
Company
develops semiconductor technologies and packaging solutions for its product portfolio.
What you will do
- Develop and refine packaging processes and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability targets.
- Apply Design of Experiments and statistical methods to optimize processes and specifications, documenting results in technical reports.
- Design and maintain equipment for evaluating packaging technologies under simulated field conditions, including heat, humidity, temperature cycling, and dynamic forces.
- Define material specifications and collaborate with supplier quality and procurement teams.
- Develop techniques, tools, and quality screens to identify packaging reliability risks and establish reliability benchmarks.
- Lead problem-solving and continuous-improvement initiatives, advise internal teams and partners, and standardize qualification and manufacturing quality practices.
Requirements
- Bachelor’s degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience; alternatively, a master’s degree with 2+ years or a PhD with 6+ months of relevant experience.
- Proficiency in Statistical Process Control and Design of Experiments principles.
- Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing.
- Competency with mechanical design software such as SolidWorks or AutoCAD.
- Applicants must be able to work on-site in Phoenix, Arizona, United States.
- This position is not eligible for immigration sponsorship.
Nice to have
- Experience leading technical innovation and managing complex, time-sensitive projects.
- Understanding of semiconductor fabrication processes and packaging technologies.
- Experience with supply chain management in manufacturing or materials qualification.
- Experience with high-precision manufacturing methods, including stamping and CNC machining.
Culture & Benefits
- Competitive compensation with stock bonuses.
- Health, retirement, and vacation benefits.
- Collaboration with cross-functional teams on advanced packaging and manufacturing technologies.
- Shift 1 schedule in the United States.
Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →
Похожие вакансии
11 дней назад
Supplier Engineer IV (Semiconductor Manufacturing)
116 000 - 159 500$
10 дней назад
Mechanical Engineer (Semiconductor Equipment)
124 000 - 171 000$
10 дней назад
Manufacturing Engineer II (Semiconductor Manufacturing)
78 500 - 108 000$
11 дней назад
Mechanical Engineer (Semiconductor)
100 000 - 136 500$
10 дней назад
Process Engineer (Semiconductor Manufacturing)
108 000 - 148 500$
11 дней назад
Equipment Engineer III - Technology Development (Semiconductor)
89 082 - 133 623$