Process Engineering Manager (Electroplating)

Location: Singapore, SGP. Onsite at Science Park II, moving to the Tampines office starting April 2027. Travel is required up to 10% of the time.

Company

hirify.global develops materials science and engineering solutions, equipment, and technologies for semiconductor chips and advanced displays.

What you will do

• Lead a team of process engineers developing and optimizing electroplating processes for advanced semiconductor packaging.
• Manage process engineering projects and hardware characterization activities across the product range.
• Develop and implement new technologies, products, analytical instrumentation, and process methodologies.
• Troubleshoot complex process engineering issues using root cause analysis and process characterization.
• Collaborate with key customers and global cross-functional teams to resolve technical challenges.
• Prepare and validate technical documentation, specifications, reports, presentations, and product materials.

Requirements

• Bachelor’s, Master’s, or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or a related field.
• 8+ years of semiconductor process engineering experience, including hands-on expertise in electroplating or electrochemical deposition.
• Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.
• Experience leading process development, technology innovation, and product qualification in an R&D environment.
• People leadership experience with the ability to develop and mentor engineering teams.
• Expertise in process characterization, DOE, statistical analysis, troubleshooting, root cause analysis, plating chemistry, deposition uniformity, defect reduction, and process optimization.

Culture & Benefits

• Supportive work culture focused on learning, professional development, and career growth.
• Health and wellbeing programs supporting employees at work and at home.
• Regular employment with full-time hours.
• Relocation eligibility is provided.