Sr NPI Engineer (Semiconductor Manufacturing)

Location: Bayan Lepas, Malaysia; onsite, with no remote work available

Company

hirify.global is a semiconductor solutions provider developing embedded technologies for automotive, industrial, infrastructure, and IoT applications.

What you will do

• Drive new product introduction from development through transfer to mass production.
• Set up and develop products using DACA, DAF die attach, and vacuum reflow processes.
• Conduct process risk assessments, evaluation planning, and DOE-based studies.
• Establish optimal process conditions, apply SPC, and maintain process documentation.
• Analyze sample-build data, identify trends and potential issues, and prepare reports and deliverables for designers, customers, and REL-AED.
• Coordinate with QA, operations, R&D, and other cross-functional teams.

Requirements

• Bachelor’s degree in Mechanical, Electrical, Materials, or related Engineering.
• Understanding of manufacturing processes such as dicing, die attach, wire bonding, and molding.
• Knowledge of process flows, defect mechanisms, SPC, data analysis fundamentals, and basic DOE concepts.
• Strong problem-solving and analytical skills, including the ability to analyze production and sample-build data.
• Clear communication skills and the ability to prepare technical reports and summaries.
• Detail-oriented, structured, willing to learn, and able to manage multiple NPI tasks.

Nice to have

• Experience in semiconductor, assembly, manufacturing, or process engineering.
• Relevant internship or project experience for fresh graduates.

Culture & Benefits

• Regular permanent employment with a competitive benefits package.
• Work within a global organization of more than 21,000 engineers and problem solvers across over 30 countries.
• Collaborative culture grounded in transparency, agility, innovation, global cooperation, and entrepreneurship.
• Opportunity to contribute to semiconductor technologies for automotive, industrial, infrastructure, and IoT applications.