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4 часа назад

ADCE Packaging Design Architect (Semiconductor)

220 920 - 311 890$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior/lead
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

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TL;DR

ADCE Packaging Design Architect (Semiconductor): Driving end-to-end substrate design development from concept through tape-out with an accent on physical layout, routing, and performance optimization. Focus on establishing design, performance, and cost tradeoffs while collaborating with silicon and hardware teams to ensure optimal system-level integration.

Location: Must be based in the US (On-site presence required)

Salary: $220,920–$311,890 USD

Company

hirify.global is a global leader in semiconductor manufacturing, delivering cutting-edge silicon process and packaging technology for the AI era.

What you will do

  • Drive end-to-end substrate design development from initial concept to final tape-out.
  • Perform substrate fit and routing studies to balance design, performance, and cost requirements.
  • Collaborate with silicon and hardware teams to optimize silicon-package-board performance and pinout.
  • Define substrate design rules and conduct comprehensive internal and external design reviews.
  • Analyze data and resolve Design Rule Checks (DRCs) to ensure high-quality package design.
  • Manage documentation and collateral within the product lifecycle management system.

Requirements

  • Ph.D. or Master’s degree in Electrical, Chemical, or Mechanical Engineering, or Material Science.
  • 10+ years of in-depth experience in Package, PCB design, or IC digital design.
  • Strong background in semiconductor fabrication and packaging processes.
  • Proficiency with design and electromagnetic simulation tools such as Mentor, Cadence, SPICE, and Ansys.
  • Expertise in Cadence Allegro (APD/SiP, Concept HDL, Sigrity) or Mentor Xpedition platforms.
  • Must be able to work on-site at designated US hirify.global locations.

Nice to have

  • Knowledge of assembly process, test, and characterization techniques.
  • Experience working independently across various levels of design abstraction.

Culture & Benefits

  • Competitive total compensation package including base pay and stock bonuses.
  • Comprehensive health, retirement, and vacation benefit programs.
  • Opportunity to work on state-of-the-art semiconductor manufacturing technology.
  • Collaborative environment within a worldwide factory network.

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