ADCE Packaging Design Architect (Semiconductor)
Мэтч & Сопровод
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Описание вакансии
TL;DR
ADCE Packaging Design Architect (Semiconductor): Driving end-to-end substrate design development from concept through tape-out with an accent on physical layout, routing, and performance optimization. Focus on establishing design, performance, and cost tradeoffs while collaborating with silicon and hardware teams to ensure optimal system-level integration.
Location: Must be based in the US (On-site presence required)
Salary: $220,920–$311,890 USD
Company
is a global leader in semiconductor manufacturing, delivering cutting-edge silicon process and packaging technology for the AI era.
What you will do
- Drive end-to-end substrate design development from initial concept to final tape-out.
- Perform substrate fit and routing studies to balance design, performance, and cost requirements.
- Collaborate with silicon and hardware teams to optimize silicon-package-board performance and pinout.
- Define substrate design rules and conduct comprehensive internal and external design reviews.
- Analyze data and resolve Design Rule Checks (DRCs) to ensure high-quality package design.
- Manage documentation and collateral within the product lifecycle management system.
Requirements
- Ph.D. or Master’s degree in Electrical, Chemical, or Mechanical Engineering, or Material Science.
- 10+ years of in-depth experience in Package, PCB design, or IC digital design.
- Strong background in semiconductor fabrication and packaging processes.
- Proficiency with design and electromagnetic simulation tools such as Mentor, Cadence, SPICE, and Ansys.
- Expertise in Cadence Allegro (APD/SiP, Concept HDL, Sigrity) or Mentor Xpedition platforms.
- Must be able to work on-site at designated US locations.
Nice to have
- Knowledge of assembly process, test, and characterization techniques.
- Experience working independently across various levels of design abstraction.
Culture & Benefits
- Competitive total compensation package including base pay and stock bonuses.
- Comprehensive health, retirement, and vacation benefit programs.
- Opportunity to work on state-of-the-art semiconductor manufacturing technology.
- Collaborative environment within a worldwide factory network.
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