10 дней назад
Package Design Engineer (AI)
82 500 - 132 000$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Package Design Engineer (AI) (Flip-Chip BGA/ASIC): Designing complex flip-chip-BGA packages for high-performance ASICs supporting AI, networking, HPC, and 5G applications with an accent on signal integrity, power integrity, thermal performance, manufacturability, and reliability. Focus on developing critical package structures for 224G+ SerDes, ADC/DAC, DDR, and HBM, while improving design processes through automation and documentation.
Location: On-site at the office in San Jose, California, USA, 5 days a week; this is not a remote-work position.
Annual base salary: USD 82,500–132,000, plus a discretionary annual bonus and potential equity awards.
Company
develops semiconductor and infrastructure technology, including ASICs for artificial intelligence, networking, high-performance computing, and 5G applications.
What you will do
- Design complex flip-chip-BGA packages for high-performance ASICs.
- Own package design considerations including signal integrity, power integrity, manufacturability, reliability, and thermal performance.
- Develop critical package structures for high-speed SerDes, ADC/DAC, DDR, HBM, and related interfaces.
- Manage schedules, priorities, and deliverables across two or more projects.
- Collaborate with internal engineers, worldwide team members, and external vendor designers.
- Improve design-team efficiency through process development, automation, and documentation.
Requirements
- BSEE or a similar degree with at least 2 years of flip-chip-BGA package design experience, including high-speed SerDes, or an MSEE or PhD.
- Knowledge of electrical engineering fundamentals and package-level signal integrity and power integrity.
- Experience with Cadence APD (Allegro Package Designer) or an equivalent layout tool.
- Self-management and organizational skills.
- Ability to cooperate with worldwide teams across multiple time zones and coordinate co-design with internal and external designers.
- Physical design and layout is a foundational responsibility.
Nice to have
- At least 1 year of experience with Cadence SKILL for Allegro or similar design-automation coding.
- Interest in process automation and design efficiency improvements.
Culture & Benefits
- Work as part of a worldwide R&D team.
- Medical, dental, and vision plans.
- 401(k) participation with company matching and an Employee Stock Purchase Program.
- Company-paid holidays, paid sick leave, vacation time, and applicable paid family leave.
- Employee Assistance Program and potential annual equity awards.
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