Silicon Packaging Engineer - Intern & New Grad (Photonics)

Location: Mountain View, California, United States; flexible hybrid workplace model

Hourly range: $43–$67 USD per hour

Company

hirify.global develops photonic engines and data center infrastructure for large-scale AI and high-performance computing workloads.

What you will do

• Analyze high-speed interfaces including PCIe, UCIe, and SerDes, and work on signal and power integrity, PDN simulation, eye diagrams, jitter, and S-parameters.
• Perform CFD and package-level thermal analysis, evaluate heat sinks and thermal interface materials, and contribute to liquid-cooling solutions.
• Support mechanical and thermo-mechanical design through structural analysis, tolerance stack-ups, GD&T, FEA, solder-fatigue analysis, and CTE-mismatch evaluation.
• Contribute to 2.5D/3D packaging, fiber attach, heterogeneous integration, assembly yield, and reliability.
• Work on co-packaged optics from concept through high-volume production alongside experienced engineers.

Requirements

• Pursuing or recently completed a BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.
• Hands-on experience through coursework, capstone projects, research labs, or internships.
• Familiarity with at least one relevant tool, such as SolidWorks, ANSYS, ADS, Cadence, Python, or MATLAB.
• Curiosity, collaboration skills, and comfort asking questions.
• Capacity to comply with federally mandated U.S. export control requirements.

Culture & Benefits

• Flexible hybrid workplace model.
• Medical, dental, and vision coverage.
• Retirement savings matching, life insurance, and disability coverage.
• Vacation, sick leave, public holidays, and paid family leave.
• Training and development, commuter benefits, and equity grants for full-time employees.