Advanced Packaging Intern, MS - Summer 2027

Location: Santa Clara, California, United States

Salary: $37–$73 per hour, plus eligibility for bonus and equity plans.

Company

hirify.global develops semiconductor solutions for enterprise, cloud, AI, and carrier data infrastructure.

What you will do

• Perform signal integrity, power integrity, and electromagnetic simulations for advanced packaging and high-speed interconnects.
• Evaluate package and PCB designs against electrical performance requirements.
• Analyze power distribution networks and high-speed channels to identify and resolve signal and power delivery issues.
• Execute simulation and verification activities supporting SI/PI sign-off.
• Collaborate with package design, layout, hardware, and IP teams to optimize electrical performance.
• Develop Python, MATLAB, or similar scripting tools to automate analysis workflows and document technical findings.

Requirements

• Currently enrolled in a master's degree program in Electrical Engineering, Computer Engineering, or a related discipline, with expected graduation between Fall 2027 and Summer 2028.
• Strong understanding of electromagnetic fundamentals, signal integrity concepts, circuit simulation, and hardware design.
• Experience or knowledge evaluating the electrical behavior of package, PCB, or interconnect structures.
• Exposure to frequency-domain and time-domain analysis methodologies and electrical simulation tools.
• Ability to analyze data, organize technical information, document results, and communicate findings effectively.
• Ability to collaborate with engineers across multiple disciplines, teams, and locations.

Nice to have

• Experience with 2-D or 3-D electromagnetic simulation tools such as Ansys HFSS, SIwave, or Cadence Clarity.
• Experience with SI, PI, channel analysis, power distribution network analysis, or related simulations.
• Familiarity with 2.5D and 3D packaging architectures and IC package design tools such as Cadence APD.
• Proficiency in Python, MATLAB, or other scripting languages for data analysis and automation.

Culture & Benefits

• Work with package design, layout, hardware, and IP engineering teams on advanced semiconductor technologies.
• Intern benefits include medical, dental, and vision coverage, mental health resources, discounts, and paid holidays.
• Additional compensation may be available for intern PhD candidates.
• Access to export-controlled technology may require eligibility under U.S. export control laws or an export license review.

Hiring process

• Interviews are intended to assess individual experience, thought process, and communication skills.
• AI tools, transcription applications, automated note-taking bots, and real-time answer generators are prohibited during interviews.