Advanced Packaging Intern, BS - Summer 2027 (Semiconductor)

Location: Burlington, VT, United States

Salary: $31–$62 per hour, plus eligibility for bonus and equity plans.

Company

hirify.global develops semiconductor solutions for enterprise, cloud, AI, and carrier data infrastructure.

What you will do

• Evaluate package and PCB designs against challenging electrical requirements.
• Perform signal integrity and power integrity simulations for design sign-off.
• Work closely with physical designers and IP teams to optimize electrical performance.
• Support multi-chip and multi-component package configurations with high-speed IP requirements.
• Contribute to advanced packaging initiatives, including 3D packaging, co-packaged optics, and advanced substrate materials.

Requirements

• Currently enrolled in a Bachelor's degree program in Electrical Engineering, with studies planned for completion in 2028.
• Interest in hardware design and a strong understanding of electromagnetic fundamentals.
• Knowledge of signal integrity concepts, circuit extraction, and simulation techniques.
• Strong communication, presentation, and documentation skills.
• Applicants must be eligible to access export-controlled technology under applicable U.S. regulations; an export license review may be required.

Culture & Benefits

• Full-time summer internship within the Advanced Packaging team.
• Medical, dental, and vision coverage for interns.
• Paid holidays, discounts, and mental health resources.
• Additional compensation may be available for intern PhD candidates.
• Bonus and equity plan eligibility may include a new-hire equity grant and annual equity refreshers.

Hiring process

• Interviews assess individual experience, thought process, and communication skills.
• AI tools, transcription applications, automated answer generators, and note-taking bots are not permitted during interviews.