Senior Director, Silicon Hardware Engineering - Boards, Packaging, & Reliability (Semiconductor)

Location: San Jose, California, United States

Salary: $231,500–$335,000 USD annually for the Bay Area California market

Company

hirify.global is an independent pure-play FPGA solutions provider developing programmable technologies for AI, cloud, networking, and edge markets.

What you will do

• Lead and scale chip package development, board hardware development, and silicon power and reliability engineering functions.
• Build and manage distributed engineering teams across U.S. and Asian sites while establishing goals, KPIs, standards, and performance expectations.
• Define technical direction for 2.5D/3D IC, flip-chip, high-density interconnect, signal integrity, and power integrity methodologies.
• Oversee board hardware development from concept through bring-up, including design-for-manufacturability and design-for-test.
• Lead power budgeting, electromigration, ESD, reliability qualification, and silicon development methodology improvements.
• Own program execution, cost reduction, supplier qualification, vendor management, risk management, and executive technical communication.

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a closely related field; a master’s degree is preferred.
• 15+ years of progressive semiconductor hardware engineering experience, including at least 5 years in a senior leadership or director-level role.
• Experience managing global, cross-functional engineering teams across U.S. and Asian sites.
• Deep expertise in advanced chip packaging, substrate design, OSAT management, board hardware development, schematic design, PCB layout, and bring-up.
• Hands-on experience with signal integrity and power integrity analysis using Ansys SIwave, Cadence Sigrity, HyperLynx, or equivalent tools.
• Understanding of synthesis, place and route, timing closure, DFT, vendor qualification, cost reduction, and complex engineering program execution. Applicants must be eligible for required U.S. export authorizations.

Culture & Benefits

• Work within an independent organization focused on FPGA innovation and rapid execution.
• Collaborate with engineering, architecture, SoC design, system integration, product management, suppliers, customers, and technology partners.
• Receive incentive opportunities based on individual and company performance.
• Use data-driven operational reviews and structured supplier scorecards to improve quality, predictability, cycle time, and cost.