Principal NPI Product Engineer (Analog/Mixed-Signal IC)

Location: Hybrid in Burlington, ON; Ottawa, ON; or Bristol, UK, with four days in the office from Monday through Thursday.

Company

hirify.global develops high-performance optical and analog/mixed-signal ICs for next-generation optical networking infrastructure.

What you will do

• Own NPI programs from product concept and silicon development through product release and transfer to full-volume manufacturing.
• Coordinate cross-functional work across design, marketing, validation, test, characterization, quality, reliability, applications engineering, and operations.
• Define and drive Design for Testability and Design for Manufacturability requirements.
• Develop, verify, and optimize ATE test programs, characterization plans, production test limits, and test coverage.
• Analyze ATE and bench data across process, voltage, and temperature variations, including ATE-to-bench correlation and process capability studies.
• Lead yield optimization, failure analysis, reliability qualification, CAPA closure, and continuous improvement activities.

Requirements

• Bachelor’s degree in Electrical Engineering or a related field; a master’s degree is strongly preferred.
• 10+ years of experience in semiconductor product engineering, test engineering, or design engineering.
• Experience owning silicon bring-up, product characterization, and production transfer programs.
• Hands-on experience with ATE test development, ATE-to-bench correlation, and production test limit setting.
• Strong knowledge of DfT and DfM principles, with proficiency in statistical analysis tools such as JMP or Excel.
• Experience with scripting or automation in Python, TCL, or an equivalent language, plus strong analytical and cross-functional communication skills.

Nice to have

• Analog/mixed-signal or optical IC characterization experience, including TIA, CDR, LimitAmp, or high-speed SerDes.
• Experience with Advantest or Teradyne ATE platforms.
• Knowledge of JEDEC reliability qualification methods such as HTOL, HAST, ESD, and latch-up.
• Exposure to ATPG, MBIST, boundary scan DFT flows, foundry, or OSAT collaboration.

Culture & Benefits

• Work on CMOS and BiCMOS ICs supporting 400G, 800G, and 1.6T optical networking infrastructure.
• Own products end to end with broad cross-functional exposure.
• Collaborate with design, reliability, fab, and manufacturing teams across global sites.
• Receive competitive compensation, benefits, and professional development opportunities.