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4 дня назад

Substrate Quality and Reliability Engineer (Semiconductor)

103 730 - 198 820$
Формат работы
hybrid
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Substrate Quality and Reliability Engineer (Semiconductor): Driving substrate capacity expansion, qualification strategies, and manufacturing quality for Intel package and assembly technologies with an accent on reliability modeling, materials and process development, and risk reduction. Focus on defining inspection and testing mechanisms, analyzing reliability data, developing acceleration techniques, and solving customer-facing manufacturing issues during technology development and high-volume manufacturing ramps.

Location: Phoenix, Arizona, United States. Regular onsite presence is required, with a hybrid model allowing time at the hirify.global site and off-site.

Annual salary: $103,730–$198,820 USD.

Company

hirify.global develops semiconductor technologies, package and assembly solutions, and manufacturing systems for computing products.

What you will do

  • Drive substrate capacity expansion and influence packaging and assembly technology decisions during development and high-volume manufacturing ramps.
  • Develop quality, reliability, materials, process, and technology targets for substrate packaging components.
  • Define inspection, screening, testing, and qualification strategies to reduce yield and reliability risks.
  • Build reliability models using statistical analysis and develop accelerated life testing methods and analytical tools.
  • Partner with packaging technology, manufacturing, supplier, and engineering teams to improve process maturity and product quality.
  • Investigate customer requests and quality events, recommending specification or formulation changes when needed.

Requirements

  • Master’s degree with 2+ years of industry experience, or a PhD, in materials science, engineering, physics, chemistry, or a related discipline.
  • 2+ years of experience in substrate manufacturing, semiconductor fabrication, package assembly, wafer-level processing, or board/system integration.
  • Experience collaborating across cross-functional teams and solving complex technical problems.
  • Experience with empirical data collection, statistical analysis, reliability statistics, or design of experiments is preferred.
  • Technical knowledge of manufacturing process development, material characterization, design validation, component testing, or accelerated life testing is preferred.
  • Programming or scripting experience for data analysis, such as Python or SQL, is preferred.

Culture & Benefits

  • Hybrid work model combining onsite work at the assigned hirify.global site with off-site work.
  • Competitive compensation with potential stock bonuses.
  • Health, retirement, and vacation benefits.
  • Cross-functional environment focused on technical problem solving, innovation, and responsible business practices.

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