Packaging Research and Development Engineer (Semiconductor Packaging)

Location: On-site in Phoenix, Arizona, United States

Salary: $133,800–$188,890 annual

Company

hirify.global develops semiconductor technologies and advanced manufacturing solutions.

What you will do

• Develop processes and materials for advanced substrate packaging, embedded die packaging, and heterogeneous integration.
• Define equipment configurations, process specifications, and integrated process flows for new technologies.
• Plan and conduct design of experiments to characterize process windows and process, equipment, and materials interactions.
• Drive improvements in process capability, stability, quality, reliability, cost, yield, automation, and productivity.
• Lead and participate in cross-functional teams supporting substrate technology development.
• Work with equipment and materials suppliers and spend most of the time on the factory floor.

Requirements

• Master’s degree in a relevant science or engineering discipline with 3+ years of related experience, or PhD with 1+ year of related experience.
• Relevant disciplines include mechanical engineering, chemical engineering, materials science, physics, or chemistry.
• Experience in mechanical and materials engineering, materials characterization, mechanical design, reliability assessment, and failure analysis.
• Experience with semiconductor packaging, substrate or embedded die technologies, heterogeneous integration, process equipment, factory operations, or equipment suppliers.
• Expertise in DOE, statistical analysis, process development, root-cause investigation, yield, reliability, quality, and process capability improvement.
• Strong communication and teamwork skills; willingness to travel less than 5% and flexibility regarding working hours and responsibilities.

Nice to have

• Research experience in semiconductor packaging, materials, manufacturing processes, or related fields.
• Experience with SPC, process tool ownership, equipment troubleshooting, statistical design of experiments, JMP, JSL, Python, relational databases, or machine learning.
• Experience with organic and inorganic materials and characterization techniques such as DSC, TGA, D/TMA, FTIR, XPS, TOF-SIMS, EDX, or SEM.

Culture & Benefits

• Work in a first-of-a-kind embedded die packaging facility with advanced substrate manufacturing technologies.
• Benefits include health coverage, retirement programs, vacation, competitive pay, and stock bonuses.
• Shift 1 schedule in the United States.