Package Design Principal Engineer (High-Speed IC Packaging)

Location: Bangalore, India

Company

hirify.global develops semiconductor solutions and advanced packaging technologies for enterprise, cloud, AI, and carrier infrastructure.

What you will do

• Drive high-speed microelectronic package development from concept through tapeout.
• Partner with package architects and technical leads to select technologies that meet manufacturability, performance, reliability, and cost requirements.
• Develop C4 and BGA ball maps optimized for signal integrity, power integrity, and layout efficiency.
• Plan and validate netlist mappings across dies, interposers, and substrates, including die placement, padstacks, net assignments, and package-level connectivity.
• Create and maintain Package Requirement Documents covering die arrangements, stackups, and design constraints.
• Collaborate with chip, board design, and electrical simulation teams on package and system co-design.

Requirements

• 13–16 years of related professional experience.
• Experience developing netlists, schematics, C4 and BGA ball maps for large, complex, high-pin-count packages.
• Proficiency with Cadence OrbitIO, Integrity System Planner, or equivalent tools.
• Strong understanding of package design rules, breakout, place and route, signal shielding, reference planes, power distribution, and pinout optimization.
• Knowledge of signal and power integrity fundamentals, packaging architectures such as 2D, 2.5D, CoWoS, EMIB, CPO, and CPC, plus thermal and mechanical constraints.
• Experience with package process and flow development, library maintenance, basic scripting, foundry design rules, and substrate manufacturing constraints.

Nice to have

• Experience running and interpreting signal and power simulations.
• Experience contributing to tool, process, and flow development.
• Experience collaborating across global time zones.

Culture & Benefits

• Eligible for bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
• Competitive compensation and benefits.
• Collaborative, transparent, and inclusive work environment.
• Resources and opportunities for professional growth and development.
• Employment may require eligibility to access export-controlled technology and completion of an export license review where applicable.

Hiring process

• Interviews assess individual experience, thought process, and communication skills.
• AI tools, transcription apps, automated answer generators, and automated note-taking bots are not permitted during interviews.