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5 дней назад

Technical Sales & Applications Program (TSAP) – Field Application Engineer, Entry Level (Embedded Systems)

Формат работы
onsite
Тип работы
fulltime
Грейд
junior
Английский
b2
Страна
US
Релокация
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Technical Sales & Applications Program (TSAP) – Field Application Engineer, Entry Level (Embedded Systems) (Semiconductors/Embedded Systems): Developing customer-facing technical expertise through structured training and hands-on support for NXP MCU/MPU solutions, embedded software, and system applications with an accent on proof-of-concept development, debugging, design support, and customer collaboration. Focus on solving embedded system integration challenges, validating hardware and software in the lab, and translating customer needs into technical solutions.

Location: Austin (Oakhill, Office), United States. Willingness to relocate to Austin and travel primarily within North America is required.

Company

hirify.global develops semiconductor, embedded, secure edge intelligence, automotive, industrial, IoT, and connected-device technologies.

What you will do

  • Complete a 9–12 month technical sales and applications development program combining structured learning with on-the-job training.
  • Support sales teams and customers with MCU/MPU selection, product bring-up, software-stack integration, and NXP portfolio guidance.
  • Lead proof-of-concept development, product evaluations, debugging, integration, lab validation, and system-level troubleshooting.
  • Review schematics and PCBs, and use oscilloscopes, probes, power analyzers, and software debug tools.
  • Prepare technical presentations, demonstrations, and training materials, and represent NXP in customer and industry activities.
  • Collaborate with sales, marketing, product management, engineering, partners, and customers to identify opportunities and improve technical collateral, tools, software, and documentation.

Requirements

  • Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, Mechatronics, or a related technical field.
  • Graduated within the past 24 months or graduating soon, with a minimum GPA of 3.0.
  • Foundational knowledge of analog and digital circuits, embedded systems, microcontrollers, processors, semiconductor applications, and software development in C, C++, Python, or similar languages.
  • Familiarity with embedded debugging and development environments, including IDEs, SDKs, evaluation boards, and laboratory tools.
  • Strong problem-solving, analytical, communication, collaboration, curiosity, and customer-focus skills, supported by technical presentation, leadership, teamwork, internship, co-op, research, or project experience.
  • Willingness to relocate to Austin and travel primarily within North America.

Nice to have

  • ARM-based embedded systems, RTOS, or embedded Linux experience.
  • Robotics software, motion control, sensor integration, real-time control, or motor-control knowledge.
  • Familiarity with UART, SPI, I2C, CAN, USB, or Ethernet interfaces.
  • Exposure to edge AI, embedded ML, sensing, perception, sensor fusion, embedded security, safety, or reliability.

Culture & Benefits

  • Structured training from NXP subject-matter experts and leaders.
  • Hands-on development alongside experienced field application engineers, technical sales engineers, product teams, partners, and customers.
  • Permanent FAE placement in the Americas Sales organization after successful program completion, based on business needs and candidate preferences.
  • Customer-focused, cross-functional environment centered on technical expertise, innovation, and business development.

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