5 дней назад
Technical Sales & Applications Program (TSAP) – Field Application Engineer, Entry Level (Embedded Systems)
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
Technical Sales & Applications Program (TSAP) – Field Application Engineer, Entry Level (Embedded Systems) (Semiconductors/Embedded Systems): Developing customer-facing technical expertise through structured training and hands-on support for NXP MCU/MPU solutions, embedded software, and system applications with an accent on proof-of-concept development, debugging, design support, and customer collaboration. Focus on solving embedded system integration challenges, validating hardware and software in the lab, and translating customer needs into technical solutions.
Location: Austin (Oakhill, Office), United States. Willingness to relocate to Austin and travel primarily within North America is required.
Company
develops semiconductor, embedded, secure edge intelligence, automotive, industrial, IoT, and connected-device technologies.
What you will do
- Complete a 9–12 month technical sales and applications development program combining structured learning with on-the-job training.
- Support sales teams and customers with MCU/MPU selection, product bring-up, software-stack integration, and NXP portfolio guidance.
- Lead proof-of-concept development, product evaluations, debugging, integration, lab validation, and system-level troubleshooting.
- Review schematics and PCBs, and use oscilloscopes, probes, power analyzers, and software debug tools.
- Prepare technical presentations, demonstrations, and training materials, and represent NXP in customer and industry activities.
- Collaborate with sales, marketing, product management, engineering, partners, and customers to identify opportunities and improve technical collateral, tools, software, and documentation.
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, Mechatronics, or a related technical field.
- Graduated within the past 24 months or graduating soon, with a minimum GPA of 3.0.
- Foundational knowledge of analog and digital circuits, embedded systems, microcontrollers, processors, semiconductor applications, and software development in C, C++, Python, or similar languages.
- Familiarity with embedded debugging and development environments, including IDEs, SDKs, evaluation boards, and laboratory tools.
- Strong problem-solving, analytical, communication, collaboration, curiosity, and customer-focus skills, supported by technical presentation, leadership, teamwork, internship, co-op, research, or project experience.
- Willingness to relocate to Austin and travel primarily within North America.
Nice to have
- ARM-based embedded systems, RTOS, or embedded Linux experience.
- Robotics software, motion control, sensor integration, real-time control, or motor-control knowledge.
- Familiarity with UART, SPI, I2C, CAN, USB, or Ethernet interfaces.
- Exposure to edge AI, embedded ML, sensing, perception, sensor fusion, embedded security, safety, or reliability.
Culture & Benefits
- Structured training from NXP subject-matter experts and leaders.
- Hands-on development alongside experienced field application engineers, technical sales engineers, product teams, partners, and customers.
- Permanent FAE placement in the Americas Sales organization after successful program completion, based on business needs and candidate preferences.
- Customer-focused, cross-functional environment centered on technical expertise, innovation, and business development.
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