Product Applications Engineer (Lithography)

Location: Hsinchu City, Taiwan; frequent travel to customer sites in the USA and Asia, with travel of up to 50% of the time

Company

hirify.global designs, manufactures, and services complex equipment used by technology companies to produce advanced semiconductor and electronic devices.

What you will do

• Provide pre- and post-sales technical expertise for lithography stepper systems.
• Support customer installation, system integration, training, diagnostics, and technical issue resolution.
• Analyze customer applications and samples while improving process yield and throughput.
• Support reliability qualification, evaluation, and optimization of lithography processes.
• Present product capabilities, prepare application-related reports, and facilitate customer meetings.
• Work with cross-functional teams and regional business units to support customer sign-off and revenue requirements.

Requirements

• Master’s degree or higher in engineering, materials science, physics, chemistry, or a related field.
• At least 3 years of experience in lithography or advanced packaging processes.
• Strong analytical, customer communication, reporting, and presentation skills.
• Good spoken and written English is required.
• Willingness to travel frequently, including up to 50% of the time to domestic and international customer sites and overseas training.
• Computer literacy and a valid driver’s license are required.

Nice to have

• Experience with advanced packaging technologies such as CoWoS, EMIB, fan-out, TSV, MEMS, or wafer bonding.
• Experience working with Tier 1 advanced packaging customers.

Culture & Benefits

• Work in a cross-functional and regional team environment.
• Provide training, education, and technical assistance to colleagues, customers, and partners.
• Participate in regular technical training to maintain current product knowledge.

Hiring process

• Multiple interviews with several team members, conducted in person or virtually.
• Reference checks or a background investigation may be conducted before an offer.