DCP Equipment Engineering Intern - Summer 2027

Location: Austin (Ed Bluestein, Office), United States

Company

hirify.global operates a wafer manufacturing facility where engineering interns support semiconductor production, technology, and operations.

What you will do

• Complete an approximately 12-week summer engineering internship at the ATMC wafer manufacturing facility.
• Work with an experienced engineer mentor to troubleshoot production equipment and process issues.
• Drive one or more projects supporting safety, quality, delivery, and cost metrics.
• Optimize multi-million-dollar production equipment through parts management, preventative maintenance, cleaning, and repair.
• Optimize manufacturing processes involving materials, time, temperature, dose, and other process parameters.
• Collaborate with process engineering, equipment engineering, operations, and facilities teams on testing, tool performance improvements, installations, removals, and moves.

Requirements

• Must be currently working toward a BS in Engineering and returning to school or graduating at the conclusion of the internship.
• Preferred fields include mechanical, materials science, chemical, or electrical engineering.
• Strong verbal and written communication skills.
• Good problem-solving and interpersonal skills.
• Self-motivated, able to take initiative, and comfortable working with a mentor.

Nice to have

• Interest in the semiconductor industry.

Culture & Benefits

• Mentorship from an experienced engineer.
• Cross-functional collaboration across engineering, operations, and facilities.
• Opportunity to deliver measurable results to the business.
• Presentation of internship results to factory senior management.