Silicon Photonics Advanced Packaging Intern (Summer 2027) (Silicon Photonics)

Location: Malta, New York, USA

Salary: $20.00–$40.00 per hour

Company

hirify.global manufactures essential semiconductors and develops differentiated solutions for high-growth markets, including AI infrastructure.

What you will do

• Support silicon photonics advanced packaging innovation and customer design enablement.
• Contribute to packaging design rules, product requirements, and efficient manufacturing processes with internal teams and OSAT partners.
• Participate in cross-functional design reviews and help resolve technical, manufacturability, reliability, and yield concerns.
• Develop and apply analysis and simulation models to evaluate package performance, cost, quality, and manufacturability.
• Support qualification robustness, continuous improvement, requirements tracking, and product development through production readiness.

Requirements

• Actively pursuing a Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering, or a related field.
• Must maintain an overall GPA of at least 3.0 and remain in good academic standing.
• English fluency required for written and verbal communication.
• Ability to work at least 40 hours per week during the internship.
• Availability for up to 10% travel.

Nice to have

• Internship, research, or co-op experience in semiconductor packaging, photonics, optics, or advanced electronics.
• Exposure to thermal, mechanical, electrical, optical, or multiphysics simulation tools.
• Knowledge of semiconductor packaging, chiplets, silicon photonics, or co-packaged optics.
• Project management, leadership, communication, planning, and organizational skills.
• Interest in using AI tools and emerging technologies to improve productivity and decision-making.

Culture & Benefits

• One-on-one mentorship and assignments focused on professional growth.
• Professional development opportunities and networking with executives.
• Hands-on experience supporting semiconductor product development from concept through production readiness.
• Participation in a global intern and co-op talent pipeline.