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5 дней назад

Principal Mechanical Architect (Semiconductor Equipment)

94 100 - 123 480$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Principal Mechanical Architect (Semiconductor Equipment): Defining and leading mechanical architectures for next-generation semiconductor wafer probing and test platforms with an accent on precision motion, wafer chuck systems, thermal stability, and electromechanical integration. Focus on solving vibration, resonance, stiffness, positioning accuracy, and dynamic-performance challenges through modeling, validation, and cross-functional technical leadership.

Location: Beaverton, Oregon, United States; onsite day shift

Salary: $94,100–$123,480 per year, plus benefits and potential quarterly profit-sharing bonuses.

Company

hirify.global provides semiconductor test and measurement technologies for wafer characterization, modeling, reliability, qualification, and production testing.

What you will do

  • Define mechanical architectures for semiconductor wafer probing and test systems.
  • Architect precision motion and positioning systems, including stages, actuators, flexures, bearings, guide systems, and encoders.
  • Lead wafer handling, alignment, support, and chucking system development, including vacuum distribution, thermal management, planarity, and Z-height control.
  • Analyze and resolve vibration, resonance, stiffness, thermal stability, and dynamic-performance issues using FEA, modal analysis, tolerance analysis, and thermal-mechanical simulations.
  • Lead designs from concept through prototyping, qualification, release, production ramp, and customer support.
  • Provide technical leadership across mechanical, electrical, controls, software, optical, automation, manufacturing, supplier, and customer teams.

Requirements

  • At least 5 years of related experience with a bachelor's degree, 3 years with a master's degree, or a PhD without experience; equivalent experience is accepted.
  • Expertise in precision motion systems, positioning stages, servo systems, actuators, encoders, and advanced mechanical mechanisms.
  • Experience with semiconductor equipment, wafer probers, precision test systems, wafer chucks, wafer alignment, or related capital equipment.
  • Strong knowledge of mechanical dynamics, structural stiffness, vibration control, thermal stability, precision positioning, and tolerance analysis.
  • Experience integrating mechanical, electrical, sensor, controls, and software subsystems into complex electromechanical platforms.
  • Experience with SolidWorks, Creo, FEA tools, MATLAB, Simulink, or equivalent engineering analysis software.

Culture & Benefits

  • Cross-functional work across multidisciplinary engineering and manufacturing teams.
  • Medical, dental, vision, life insurance, and disability coverage.
  • 401(k) with company match and employee stock purchase plan.
  • Paid time off and flexible spending or savings accounts.
  • Quarterly profit-sharing bonus eligibility.

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