3 дня назад
Sr. Advanced Semiconductor Packaging Engineer (Quantum Computing)
115 000 - 135 000$
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
Sr. Advanced Semiconductor Packaging Engineer (Quantum Computing): Developing innovative and reliable packaging schemes for highly scaled ion traps in quantum computers with an accent on mechanical, thermal, electrical, optical, and detection interfaces. Focus on large-format ion trap chips, high-density I/O, heterogeneous 2.5D/3D integration, vendor process validation, and cross-functional system compatibility.
Location: Brooklyn Park, Minnesota, United States; on-site. Applicants must be U.S. Persons as defined in the posting. Candidates must not be nationals of China or Russia unless they are also U.S. citizens.
Salary: $115,000–$135,000 annually.
Company
develops a full-stack quantum computing platform for real-world applications across research and industry.
What you will do
- Develop advanced packaging concepts for mechanical, thermal, electrical, optical, and detection interfaces to next-generation ion traps.
- Create packaging strategies and processes for large-format ion trap chips with high I/O signal count and density.
- Work with vendors to implement and validate semiconductor packaging processes.
- Support all stages of ion trap development and ensure compatibility with packaging requirements.
- Coordinate with ASIC, ion trap, fabrication, optical design, and broader system teams.
- Build supplier relationships, partnerships, and co-development opportunities with third parties.
Requirements
- Bachelor’s degree or higher.
- At least 5 years of experience in an engineering or R&D environment.
- At least 3 years of experience developing advanced semiconductor packaging.
- Experience with advanced packaging concepts and cross-functional technical collaboration.
- U.S. Person status is required, including U.S. citizenship, permanent residence, or qualifying asylum or refugee status.
- Due to national security requirements, Chinese or Russian nationals must also be U.S. citizens.
Nice to have
- PhD in Physics or Engineering.
- Experience with large-area multi-chip packaging, heterogeneous integration, and 2.5D/3D packaging.
- Experience with high-density I/O, photonic packaging, and fiber-to-chip coupling.
- Track record of innovation and intellectual property development.
Culture & Benefits
- Fast-paced, multifunctional, team-based technical environment.
- Employer-subsidized medical, dental, and vision insurance.
- 401(k) plan with company match and student loan repayment benefit.
- Equity opportunities, paid time off, sick leave, and 12 paid holidays.
- Paid parental leave and employee discount programs.
- Pre-employment drug testing is required for safety-sensitive positions.
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