Head of Thermal Engineering (AI)

Location: Munich, Germany (Remote/Hybrid with moderate travel within Europe and occasional travel to the US).

Salary: €120,000 – €130,000

Company

hirify.global is a startup building a Physics AI platform to redefine hardware design, simulation, and semiconductor verification.

What you will do

• Build, lead, and mentor a high-performing team of thermal engineers across Europe.
• Drive technical adoption of the platform by leading proof-of-concept evaluations and technical demonstrations.
• Guide customer engineering teams in validating complex thermal management systems and cooling strategies.
• Act as a key feedback channel to product and engineering teams to shape the platform's roadmap.
• Represent the company at major industry conferences and semiconductor events.

Requirements

• Degree in Mechanical or Electrical Engineering or a related technical field.
• 15+ years of experience in thermal management and cooling solutions.
• Expert-level mastery of commercial simulation software such as Flotherm, Ansys Icepak/Fluent, or Simcenter STAR-CCM+.
• Deep familiarity with semiconductor electronics packaging and foundry ecosystems.
• Practical programming experience in Python or C++ for workflow automation.
• Proven track record in managerial or technical leadership roles.

Nice to have

• Experience with structural mechanical simulations (FEA) or Signal/Power Integrity (SI/PI).
• Direct experience commercializing EDA or CAE simulation tools.
• Background in technical pre-sales or application engineering (FAE).

Culture & Benefits

• Work at the intersection of state-of-the-art AI models and fundamental physics.
• Collaborate with world-class researchers and engineers in a fast-moving startup environment.
• Opportunity to redefine how next-generation silicon and hardware are architected.