Lead (Thermal Management)

Location: Watertown, Massachusetts, United States; hybrid workplace

Company

Technology startup developing ultra-fast physics simulation software for engineering applications across aerospace, automotive, energy, semiconductor, and quantum computing industries.

What you will do

• Define the product strategy and roadmap for optimizing simulation solver technology for semiconductor thermal management.
• Develop applications for microfluidics, phase-change materials, liquid cooling, immersion systems, and 3D IC packaging.
• Serve as the primary chip-cooling subject matter expert, connecting solver developers with external hardware architects.
• Architect simulation-based solutions for major semiconductor companies and hyperscalers facing complex thermal challenges.
• Demonstrate the advantages of fast-cycle, GPU-accelerated simulation compared with legacy CFD tools.
• Recruit and mentor a team of thermal application engineers as the semiconductor portfolio grows.

Requirements

• PhD or MS in Mechanical Engineering, Applied Physics, or a related field focused on heat transfer and fluid dynamics.
• 8+ years of experience in electronics thermal management, including thermal architecture for high-TDP processors or high-performance server systems.
• Expert-level proficiency with thermal simulation tools and a strong understanding of the underlying physics.
• Deep knowledge of AI hardware roadmaps, Open Compute Project standards, and the transition from air cooling to liquid cooling.
• Established network with major foundries and data center equipment manufacturers.

Culture & Benefits

• Competitive compensation with equity in a fast-growing startup.
• Medical, dental, and vision insurance.
• 401(k) contribution.
• Gym allowance.
• Collaborative environment with thoughtful and technically experienced coworkers.