PCB Layout Lead (AI Hardware)

Location: Remote within the United States; Sunnyvale, California hybrid work is highly preferred.

Base salary: $210,000–$230,000+ annually, with potential bonus and equity.

Company

hirify.global builds large-scale AI computing hardware, including AI chips and systems designed to deliver high-speed model training and inference.

What you will do

• Own multilayer PCB layout from component placement through fabrication and assembly release.
• Translate schematics, mechanical constraints, and electrical requirements into constraint-driven board designs.
• Define stackups, controlled-impedance structures, routing rules, reference planes, return paths, and length- and phase-matching constraints.
• Place and route high-speed digital, high-current power, and sensitive analog circuits, including dense BGA fanout and differential interfaces.
• Collaborate with electrical, signal-integrity, power-integrity, mechanical, thermal, compliance, manufacturing, and test engineers to resolve layout issues.
• Support DFM, DFA, and DFT reviews, prototype builds, board bring-up, failure analysis, production revisions, and complete release-package generation.

Requirements

• Bachelor’s degree in electrical engineering, electronics engineering, or a related field, or equivalent practical experience.
• 10+ years of hands-on experience laying out complex, high-speed, multilayer PCBs.
• Expertise with Cadence Allegro PCB Designer and Constraint Manager; experience with Altium Designer or equivalent tools is relevant.
• Strong knowledge of controlled-impedance routing, differential pairs, length matching, return-path continuity, power distribution, and high-current routing.
• Experience with dense BGA escape routing, HDI structures, blind and buried vias, microvias, via-in-pad, backdrilling, IPC standards, and manufacturing requirements.
• Experience with server hardware, AI accelerators, datacenter hardware, or enterprise products, plus strong cross-functional collaboration skills.

Nice to have

• Experience designing large, high-layer-count boards for compute, networking, server, or AI accelerator systems.
• Experience routing DDR4/DDR5, PCIe Gen4/Gen5 or later, Ethernet, USB, and multi-gigabit SerDes interfaces.
• Experience with high-current, low-voltage power delivery, VRM placement, decoupling, copper balancing, and thermal optimization.
• Experience developing Allegro SKILL, scripts, or automation for layout and release workflows.
• Experience delivering first-pass functional boards from prototype through volume production.

Culture & Benefits

• Work on an AI platform designed to overcome GPU constraints.
• Access to cutting-edge AI research and opportunities to publish and open-source research.
• Work on high-performance AI supercomputing hardware.
• Startup vitality combined with job stability.
• Simple, non-corporate culture focused on individual beliefs, learning, growth, and inclusion.