Principal Printed Circuit Boards Manufacturing Engineer (AI Hardware)

Location: Hybrid onsite in Santa Clara, California, United States, or remote from Taiwan

Salary: $195,000–$285,000 per year, plus equity and bonus opportunities.

Company

Develops software and hardware solutions focused on generative AI and next-generation AI computing.

What you will do

• Own PCB fabrication technology and the supplier ecosystem for current and next-generation AI hardware.
• Perform DFM and DFA assessments to identify and mitigate manufacturing yield and cost risks.
• Establish company-wide PCB design guidelines and IPC-compliant reliability standards.
• Audit and qualify global PCB fabrication partners, monitor SPC metrics, and drive supplier process controls.
• Lead 8D corrective actions and continuous improvements in yield, cost, quality, and delivery.
• Evaluate advanced materials, high-layer-count stackups, HDI, microvias, signal and power integrity, and thermal management requirements with CAD, SI/PI, and sourcing teams.

Requirements

• Master’s degree in electrical, materials, mechanical, manufacturing engineering, or a related field.
• 10+ years of experience in PCB design, fabrication, or supplier quality for high-performance computing, AI hardware, networking, or semiconductors.
• Deep knowledge of high-layer-count boards, HDI, microvias, sequential lamination, and ultra-low-loss laminates.
• Fluency in IPC-6012, IPC-A-600, IPC-2221/2222, IPC-TM-650, and IPC-4101 standards.
• Expertise in SPC, DFMEA/PFMEA, 8D root-cause analysis, IST, and CAF testing.

Culture & Benefits

• Collaborative and inclusive environment grounded in respect, humility, and direct communication.
• Medical, dental, and vision insurance.
• 401(k) benefits and an inclusive rewards plan focused on employee wellbeing.
• Equity and performance-based bonus opportunities.