CMP Module Process Engineer IV (CMP)

Location: Boise, Idaho; Dallas, Texas; Hillsboro, Oregon; Phoenix, Arizona; or Santa Clara, California, United States. Travel required 20% of the time. Relocation eligible.

Salary: $116,000–$159,500 per year

Company

hirify.global develops materials science, engineering, and semiconductor manufacturing solutions used in advanced chips and displays.

What you will do

• Lead CMP process engineering activities across wafer-fab and equipment operations.
• Analyze process, yield, and integration data to identify, troubleshoot, and resolve complex problems.
• Lead customer discussions, define high-value problems, and implement continuous improvement projects.
• Optimize defectivity, variability, cost of ownership, preventive maintenance, process Cpk, matching, and output.
• Demonstrate and drive adoption of service technologies through customer-site evaluations, demos, and joint development programs.
• Mentor junior module process engineers and contribute to the CMP expert network and community of practice.

Requirements

• BS degree in engineering.
• 10+ years of Chemical Mechanical Planarization process experience.
• Wafer-fab and equipment experience.
• Advanced process integration knowledge and domain knowledge of at least four processes across two or more technologies.
• Ability to communicate complex ideas, anticipate objections, and persuade senior stakeholders.
• Recognized technical expertise in CMP unit processes and wafer-fab operations.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Comprehensive employee benefits supporting health and wellbeing.
• Potential eligibility for bonus and stock award programs.
• Regular customer-site travel as part of the role.