Package Assembly Process Development Integration Engineer (Advanced Packaging)

Location: On-site in Phoenix, Arizona, United States. Occasional travel may be required.

Annual salary range: $89,010–$170,630 USD.

Company

hirify.global develops semiconductor technologies and advanced packaging solutions, with the Assembly Package Test Manufacturing organization supporting its foundry business.

What you will do

• Drive technology transfer, process integration roadmaps, workflow definition, and continuous improvement for package assembly.
• Manage development and baseline data collection for technology vehicles and products.
• Lead design of experiments and data collection for die-package interactions, process flow development, qualification, yield improvement, and process specification validation.
• Validate design rules and identify cost-effective wafer-level, assembly, substrate, and materials solutions.
• Manage substrates and materials against forecasted costs and schedules.
• Coordinate stakeholders, working groups, and task forces to resolve process-level issues and technical risks.

Requirements

• Bachelor’s degree with 3+ years of experience, or a master’s degree with 2+ years, or a PhD in Engineering with 1+ year of experience.
• Experience in semiconductor, manufacturing, or advanced assembly packaging environments.
• Knowledge of advanced packaging process development, package assembly NPI methodology, design of experiments, and statistical process control.
• Experience applying statistical knowledge and problem-solving tools to technical issues.
• Strong communication, collaboration, technical decision-making, and cross-organizational influencing skills.
• Ability to work on-site in Phoenix, Arizona, United States.

Nice to have

• Knowledge of characterization techniques including CSAM, X-ray, XPS, FTIR, SEM, and EDX.
• Experience with package design and assembly process interaction.

Culture & Benefits

• Competitive pay and stock bonuses.
• Health, retirement, and vacation benefits.
• Work across organizational boundaries in an inclusive and innovative environment.