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2 дня назад

Module Development Engineer (Semiconductor)

155 520 - 219 550$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

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TL;DR

Module Development Engineer (Semiconductor): Driving innovation in advanced semiconductor packaging technology development with an accent on material selection, process optimization, and equipment metrology. Focus on leading feasibility studies, implementing technology roadmaps, and ensuring high-volume manufacturing excellence for next-generation device architectures.

Location: On-site in Hillsboro, Oregon, USA

Salary: $155,520–$219,550 USD

Company

hirify.global is a global leader in semiconductor innovation, manufacturing, and advanced packaging technology.

What you will do

  • Lead the design and development of advanced manufacturing processes and material selection.
  • Perform feasibility studies and pathfinding activities to meet device specifications.
  • Develop and implement technology roadmaps for future manufacturing needs.
  • Collaborate with equipment and material suppliers to implement enabling process technologies.
  • Utilize statistical process control and data analytics to enhance process stability.
  • Partner with cross-functional teams to ensure process integration and project deliverables.

Requirements

  • Bachelor's degree in STEM with 6+ years of experience, Master's with 4+ years, or PhD with 2+ years.
  • Experience in development methodologies, statistical process control, or data analytics.
  • Background in wafer-level assembly, semiconductor equipment development, or advanced packaging.
  • Must be eligible to work in the US without hirify.global immigration sponsorship.
  • Must be able to work on-site in Hillsboro, Oregon.

Nice to have

  • Expertise in hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.
  • Proven track record of leading programs from strategy formation through high-volume production.
  • Strong technical leadership in solving complex engineering challenges.

Culture & Benefits

  • Competitive total compensation package including stock bonuses.
  • Comprehensive health, retirement, and vacation benefit programs.
  • Opportunity to work on cutting-edge semiconductor technology at a global scale.
  • Collaborative environment focused on innovation and continuous improvement.

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