WATD Module Development Engineer (Semiconductor Packaging)

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $155,520–$219,550 USD

Company

hirify.global develops semiconductor technologies and advanced manufacturing solutions.

What you will do

• Drive technology development and enablement for high-volume manufacturing and future semiconductor technologies.
• Design and develop advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
• Perform feasibility studies, simulations, and pathfinding activities to meet device specifications.
• Build technology roadmaps and collaborate with equipment and material suppliers on enabling process technologies.
• Modify and optimize operational equipment, manufacturing techniques, production efficiency, and output.
• Apply statistical process control, data analytics, and machine learning to improve process stability and continuous improvement.

Requirements

• Bachelor’s degree in a relevant STEM discipline and 6+ years of relevant experience; or a master’s degree and 4+ years; or a PhD and 2+ years.
• Experience with development methodologies, statistical process control, and/or data analytics.
• Experience in wafer-level assembly, semiconductor equipment development or processing, or advanced packaging technology development.
• This position is on-site in Hillsboro, Oregon, United States.
• hirify.global immigration sponsorship is not available for this position.

Nice to have

• Experience with wafer-level assembly, epoxy, mold materials, or related advanced packaging fields.
• Experience leading programs from early strategy formation through high-volume production.
• Technical leadership and a record of solving complex engineering challenges.
• Experience with hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.
• Collaboration with yield, operations, supplier management, and other internal or external teams.

Culture & Benefits

• Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
• Work focuses on advancing semiconductor technology and high-volume manufacturing capabilities.
• Shift 1 schedule in the United States.