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WATD Module Development Engineer (Semiconductor Packaging)
155 520 - 219 550$
Job description
Text:
TL;DR
WATD Module Development Engineer (Semiconductor Packaging): Developing and enabling advanced semiconductor packaging and wafer-level assembly manufacturing processes with an accent on material selection, parameter optimization, equipment metrology, and process integration. Focus on feasibility studies, technology roadmaps, statistical process control, data analytics, machine learning, and improving yield, reliability, and high-volume manufacturing output.
Location: On-site in Hillsboro, Oregon, United States
Annual salary: $155,520–$219,550 USD
Company
develops semiconductor technologies and advanced manufacturing solutions.
What you will do
- Drive technology development and enablement for high-volume manufacturing and future semiconductor technologies.
- Design and develop advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
- Perform feasibility studies, simulations, and pathfinding activities to meet device specifications.
- Build technology roadmaps and collaborate with equipment and material suppliers on enabling process technologies.
- Modify and optimize operational equipment, manufacturing techniques, production efficiency, and output.
- Apply statistical process control, data analytics, and machine learning to improve process stability and continuous improvement.
Requirements
- Bachelor’s degree in a relevant STEM discipline and 6+ years of relevant experience; or a master’s degree and 4+ years; or a PhD and 2+ years.
- Experience with development methodologies, statistical process control, and/or data analytics.
- Experience in wafer-level assembly, semiconductor equipment development or processing, or advanced packaging technology development.
- This position is on-site in Hillsboro, Oregon, United States.
- immigration sponsorship is not available for this position.
Nice to have
- Experience with wafer-level assembly, epoxy, mold materials, or related advanced packaging fields.
- Experience leading programs from early strategy formation through high-volume production.
- Technical leadership and a record of solving complex engineering challenges.
- Experience with hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.
- Collaboration with yield, operations, supplier management, and other internal or external teams.
Culture & Benefits
- Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
- Work focuses on advancing semiconductor technology and high-volume manufacturing capabilities.
- Shift 1 schedule in the United States.