Module Development Engineer - CMP

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $133,800–$255,200 USD

Company

hirify.global develops computing technologies and advanced semiconductor fabrication processes for next-generation integrated circuits.

What you will do

• Drive CMP technology development and enablement for high-volume manufacturing and future semiconductor technologies.
• Design and develop manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
• Perform process and hardware pathfinding, feasibility studies, theoretical simulations, and practical engineering analysis.
• Recommend equipment modifications to improve production efficiency, manufacturing techniques, and output.
• Partner with equipment and materials suppliers to develop technology-enabling solutions.
• Track industrial process and materials trends and develop cost-sensitive technology roadmaps.

Requirements

• Bachelor’s degree in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related STEM field, plus 5+ years of semiconductor industry experience.
• Alternatively, a master’s degree plus 4+ years, or a PhD plus 1+ years, in a relevant field and semiconductor processing or fabrication experience.
• Hands-on experience in Chemical Mechanical Planarization process development, tuning, and characterization.
• Experience with major CMP equipment platforms such as AMAT or Ebara.
• Experience with CMP consumables, including slurries, pads, conditioning disks, filters, or clean chemistries.
• On-site presence in Hillsboro, Oregon, is required.

Culture & Benefits

• Collaboration across physics, chemistry, materials science, and surface science disciplines.
• Work on advanced semiconductor technologies and future device architectures.
• Competitive compensation with stock bonuses.
• Health, retirement, and vacation benefits.
• Experienced-hire position with Shift 1 scheduling in the United States.