6 дней назад
Senior Module Development Engineer (Metrology)
155 520 - 219 550$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Senior Module Development Engineer (Metrology): Developing and qualifying advanced semiconductor metrology and inspection processes and equipment for advanced packaging and future technology nodes with an accent on process integration, equipment readiness, and yield learning. Focus on building long-range metrology roadmaps, solving complex fab and process challenges, and developing predictive monitoring with AI, machine learning, and advanced process control teams.
Location: On-site in Hillsboro, Oregon, United States
Annual salary: $155,520–$219,550 USD
Company
develops semiconductor technologies, advanced packaging architectures, and high-volume manufacturing solutions.
What you will do
- Drive metrology technology development and process integration for high-volume manufacturing and future technology nodes.
- Design and develop sophisticated metrology and inspection processes, including material selection, parameter optimization, equipment configuration, recipes, specifications, SPC strategies, and sampling plans.
- Own the metrology group's long-range technology roadmap by evaluating industry trends, emerging measurement technologies, program requirements, and supplier capabilities.
- Qualify next-generation metrology and inspection equipment end to end, from installation and acceptance testing through process validation and fab readiness.
- Provide technical fab support, resolve process excursions and metrology-related holds, and improve equipment performance, availability, production efficiency, and output.
- Collaborate with suppliers, process integration, module engineering, yield, operations, AI, machine learning, and advanced process control teams.
Requirements
- Bachelor's degree in a relevant STEM field with 6+ years of relevant experience, or a master's degree with 4+ years, or a PhD with 2+ years.
- Expertise in semiconductor processing, wafer-level assembly, or cleanroom environments.
- Proficiency in process development methodologies, statistical process control, and manufacturing process improvement.
- Technical expertise in module engineering or fab process and hardware technology development.
- Ability to work on-site in Hillsboro, Oregon, United States.
Nice to have
- Strong metrology fundamentals and development experience.
- Experience with packaging processes, equipment automation development, or project management.
- Experience using data analysis tools, Python, dashboard creation, and scripting.
- Technical roadmap-level collaboration with metrology equipment vendors.
Culture & Benefits
- Competitive pay with stock bonuses.
- Health, retirement, and vacation benefits.
- Opportunity to work on advanced packaging, semiconductor technology development, and industry pathfinding programs.
- Collaboration with cross-functional engineering, manufacturing, AI, and process control teams.
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