Sr Staff Module Process Engineer - CMP (Semiconductor)

Location: Boise, Idaho or Hillsboro, Oregon, United States. On-site customer and fab-site work is required, with travel up to 20% of the time. Relocation eligible.

Salary: $140,000–$192,500 per year, plus potential bonus and stock awards.

Company

hirify.global develops materials science, engineering solutions, and equipment used in semiconductor chips and advanced displays.

What you will do

• Lead CMP process engineering activities across wafer-fab environments.
• Analyze process, yield, integration, equipment, and defect data to identify root causes and resolve complex problems.
• Work with customers to define high-value problems, propose continuous-improvement projects, and implement solutions that improve key performance indicators.
• Optimize defect and variability reduction, cost of ownership, process Cpk, tool matching, preventive maintenance, and output.
• Demonstrate and drive adoption of service technologies through customer-site evaluations, demos, and joint development programs.
• Lead CMP expert communities and mentor junior module process engineers.

Requirements

• Bachelor’s degree in engineering.
• 10+ years of Chemical Mechanical Planarization (CMP) process experience.
• Wafer-fab process and equipment experience.
• Advanced process-integration knowledge and expertise in at least three CMP process types.
• Strong data analytics, troubleshooting, and systematic root-cause diagnostic skills.
• Ability to communicate complex ideas and influence senior stakeholders.

Culture & Benefits

• Supportive environment focused on learning, development, and career growth.
• Health and wellbeing programs supporting employees at work and at home.
• Comprehensive benefits package.
• Potential eligibility for bonus and stock award programs.