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15 дней назад

Platform Hardware and Systems Engineering - Intern, Bachelor’s (Semiconductor)

91 198 - 91 202$
Формат работы
hybrid
Тип работы
fulltime
Грейд
trainee
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Platform Hardware and Systems Engineering - Intern, Bachelor’s (Semiconductor): Building and validating computing platforms through hardware and systems architecture, design, integration, and performance optimization with an accent on power, thermal, and signal integrity engineering. Focus on programming, automation, AI-enabled solutions, platform debugging, and advancing semiconductor technologies.

Location: Hybrid work at hirify.global sites in Hillsboro, Oregon; Phoenix, Arizona; Folsom and Santa Clara, California; or Austin, Texas. This position is not available in Colorado.

Salary: $91,198–$91,202 USD per hour.

Company

hirify.global develops computing technologies spanning hardware, software, semiconductor manufacturing, and AI-powered innovations.

What you will do

  • Contribute to hardware and systems architecture, design, and integration.
  • Perform platform validation, debugging, and performance optimization.
  • Work on power, thermal, and signal integrity engineering.
  • Develop programming, scripting, automation, and AI-enabled solutions.
  • Collaborate cross-functionally to advance computing platform capabilities.

Requirements

  • Currently pursuing a Bachelor's degree in computer engineering, computer science, data science, electrical engineering, chemical engineering, mechanical engineering, materials science, chemistry, mathematics, physics, or a related STEM field.
  • At least 3 months of relevant technical experience through coursework, academic projects, research, internships, co-ops, student organizations, assistantships, or similar activities.
  • Experience or interest in design, architecture, programming, scripting, data analysis, automation, modeling, simulation, validation, or debugging.
  • Strong problem-solving, communication, collaboration, and teamwork skills.
  • This position is not eligible for employment-based visa or immigration sponsorship.
  • Availability to start in Spring or Summer 2027 is required.

Nice to have

  • GPA of 3.0 or higher.
  • Hands-on coursework, research, project, or internship experience related to the role family.
  • Interest in year-long internship or co-op opportunities.

Culture & Benefits

  • Hands-on work alongside experienced engineers and technical leaders.
  • Exposure to the full technology lifecycle, from research and design through semiconductor manufacturing and deployment.
  • Hybrid work model combining on-site and off-site work.
  • Compensation package including competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
  • Relocation assistance may be available based on eligibility, current location, and role specifics.

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