AI Data Center Power Architect

Location: Fremont, United States

Company

hirify.global develops power connectivity and thermal-management solutions for AI servers, racks, and data center infrastructure.

What you will do

• Define architectures for power connectors, cables, power whips, and liquid-cooled busbar systems used in AI servers and racks.
• Design high-current power distribution systems supporting applications from 130A to 3,000A, with precise alignment for dense GPU and TPU environments.
• Build power estimation models and analyze performance-per-watt metrics and total cost of ownership for AI platforms.
• Ensure designs meet IEC 61439, IEEE, electrical safety, seismic, thermal-management, and operating-range requirements.
• Collaborate with Sales, PLM, R&D, OEMs, chip vendors, and data center operators on product roadmaps and customer requirements.
• Represent the organization in OCP, OIF, and IEEE initiatives, applying reference architectures to support standardization and partnerships.

Requirements

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Power Systems, or a related field.
• More than 10–15 years of experience in power architecture for high-density systems, including AI/ML infrastructure.
• Expertise in power connector and busbar design, high-current systems up to 3,000A, and liquid cooling for AI workloads.
• Proficiency with IEC and IEEE standards, CAD tools, and system-level validation, including short-circuit ratings up to 25kA.
• Experience working with OEMs, chip vendors such as NVIDIA, AMD, and Intel, and data center operators.
• Strong communication skills and knowledge of dynamic workload management, BBU/powershelf systems, and AI reference architectures.

Nice to have

• Master’s or PhD in Power Mechanics, Thermal Engineering, Applied Physics, or a related field.
• Experience with liquid-cooled busbars, low-GWP cooling, and high-conductivity copper alloys.

Culture & Benefits

• Cross-functional collaboration across engineering, product lifecycle management, sales, and customer-facing teams.
• Participation in industry organizations including OCP, OIF, and IEEE.
• Work focused on next-generation AI server, rack, and data center power infrastructure.